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03. Oktober 2018 13:00 ET | Quelle: SILTECTRA, GmbH

SILTECTRA Prepares to Ramp Up Wafering Services Business

Company set to make COLD SPLIT wafering technology available to semiconductor and materials manufacturers, and speed adoption of complex substrate materials, like silicon carbide DRESDEN, Germany,...
09. Juli 2018 13:00 ET | Quelle: SILTECTRA, GmbH

SILTECTRA Reports New Enabling and Cost-Of-Ownership Advantages for Cold Split Wafering Technology

SAN FRANCISCO, Calif., July 09, 2018 (GLOBE NEWSWIRE) -- SEMICON West -- SILTECTRA GmbH, a Germany-based leader in advanced wafering technology solutions and services, today revealed new enabling...
09. Mai 2018 13:00 ET | Quelle: SILTECTRA, GmbH

SILTECTRA Fortifies Market Position by Adding New Patents to Global Intellectual Property Portfolio

DRESDEN, Germany, May 09, 2018 (GLOBE NEWSWIRE) -- SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today announced that it has fortified its market position by...
26. Februar 2018 13:00 ET | Quelle: SILTECTRA, GmbH

SILTECTRA’s “Twinning” Breakthrough Promises to Vastly Reduce Wafering Costs for Manufacturers of Silicon Carbide-Based IC Devices

DRESDEN, Germany, Feb. 26, 2018 (GLOBE NEWSWIRE) -- SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today reports that it has validated a breakthrough capability for...