ASM Pacific technology introduces new products


BILTHOVEN, THE NETHERLANDS, June 13, 2000 - ASM International N.V. (Nasdaq and AEX: ASMI) reported that its 50% subsidiary, ASM Pacific Technology, Ltd., has introduced two new-generation semiconductor assembly and packaging products. The AB339 Eagle gold wire bonder and the IDEALmold, a modular automated molding system, were presented at Semicon Singapore, the industry forum for semiconductor assembly and packaging technology.

According to Patrick Lam, Managing Director of ASM Pacific Technology, Ltd., "the AB339 Eagle gold wire bonder, with significantly enhanced performance characteristics over the earlier AB339 model introduced several years ago, once again raises the industry standard for technology and value leadership."

The AB339 Eagle delivers an unprecedented 35 micron pad pitch capability, as well as significant throughput gains of 20-30% over the award-winning, existing AB339 model. Other AB339 Eagle product characteristics include, a high-speed linear XY table, a high accuracy linear indexer, a light-weight high speed bond head, and an enhanced bond quality monitor.

ASM Pacific Technology also presented the IDEALmold, an automated molding system configurable to modular capacity formats from two to eight leadframes. The product specifically addresses the in-line market, which requires molding systems of varying capacities to allow for proper line balancing. The IDEALmold, sold separately or as part of the ASM IDEALine that links several ASM equipment units to provide a factory automation solution, is the latest component in ASM's product line offering customers a complete package solution.

"ASMPT has the enabling technologies to develop equipment, for both semiconductor assembly and packaging, ahead of the market and at low cost of ownership. The outstanding success of our wire bonder line in recent years, the solid market acceptance of our full product range, particularly our integrated in-line systems, and our newest product introductions attest to this commitment," commented Mr. Lam.

ASM Pacific Technology, Ltd., headquartered in Hong Kong and with operations in Shenzhen China, Hong Kong, Singapore and Malaysia, manufactures a broad line of assembly and packaging equipment for the semiconductor industry. ASM Pacific Technology common shares are traded on the Hong Kong Stock Exchange under the symbol 522.

About ASM

ASM International is headquartered in Bilthoven, the Netherlands. ASM International's subsidiaries design, develop, manufacture and market equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for the wafer-processing, assembly and packaging segments through their facilities in the United States, Europe, Japan and Asia. ASM International's common shares trade on the NASDAQ National Market under the symbol “ASMI” and on the Euronext Stock Exchange in Amsterdam under the symbol “ASM.” More information on ASM can be found on its website at

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Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: The statements regarding orders, earnings development and the effects of research and new products on ASM’s future, and other matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation and other risks indicated in filings from time to time with the SEC and Stock Exchange Authorities.