BILTHOVEN, The Netherlands, Nov. 8, 2000 (PRIMEZONE) -- ASM INTERNATIONAL N.V. (Nasdaq:ASMI) (AEX:ASM) announced today that it hosted a copper technology seminar in Singapore on Oct. 31, 2000, which was facilitated by the Economic Development Board of Singapore (EDB). The seminar addressed copper technology and processing from front-end to back-end in semiconductor manufacturing.
The increasing complexity of semiconductors, driven by market demand for higher performance, requires an increasing number of expensive metal layers in the semiconductor structure. ASM is studying ways to reduce the impact of the high cost of these new metal layers and looks not only for solutions within the semiconductor structure (front-end) but also in the subsequent steps where the semiconductor connects to the outside world (back-end).
ASM is the only supplier with operations in the front-end and back-end segments of the semiconductor equipment market. It is, therefore, well-placed to address these problems. During the seminar, Ivo J. Raaijmakers, Chief Technology Officer of ASM Front-End, and Charles Vath III, Vice President Technology at ASM Technology Singapore, part of ASM's 55% subsidiary ASM Pacific Technology Ltd (HKSE:522), emphasized the growing interdependence between front-end and back-end technology: optimal integration of these historically separate technologies will be required to yield the best performance at low cost.
The presentations discussed development roadmaps, challenges, and results for copper-interconnects in the 100-50 nanometer technology nodes. ASM is dedicated to offer the semiconductor industry advanced, yet cost-effective production solutions, such as low-k dielectric layers with its Eagle(tm) 10 PECVD system using its Aurora(tm) 2.7 process sequence, conformal copper barrier and seed layers deposited with its ALCVD(tm) (Atomic Layer CVD(tm)) technology and copper wires in the connections between the semiconductor and the outside world using the AB339 Eagle(tm) wirebonder.
Joint development programs are currently being defined to optimally address process integration between back-end and front-end technology for copper/ low-k dual damascene metallization. Advanced packaging solutions to solve the "interconnect dilemma" are also addressed.
As a result of the many positive reactions from industry attendants, ASM plans to hold periodically similar briefings.
ASM Pacific Technology, Ltd., headquartered in Hong Kong and with operations in China, Malaysia, Hong Kong and Singapore, manufactures a broad line of assembly and packaging or back-end equipment for the semiconductor industry. ASM Pacific Technology common shares are traded on the Hong Kong Stock Exchange under the symbol 522.
ASM International is headquartered in Bilthoven, the Netherlands. ASM International's subsidiaries design, develop, manufacture and market equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for the wafer processing, assembly and packaging segments through their facilities in the United States, Europe, Japan and Asia. ASM International's common shares trade on Nasdaq National Market under the symbol "ASMI" and on the AEX Stock Exchange under the symbol "ASM". More information on ASM can be found on its website at http://www.asm.com.
ASM International is under no obligation to update the guidance in this release.
Safe Harbor Statement under the US Private Securities Litigation Reform Act of 1995: The statements regarding orders, earnings development and the effects of research and new products on ASM's future, and other matters discussed in its statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to economic conditions in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation and other risks indicated in filings from time to time with the SEC and Stock Exchange Authorities.