BILTHOVEN, The Netherlands, April 22, 2002 (PRIMEZONE) -- ASM International N.V. (Nasdaq:ASMI) (Euronext Amsterdam:ASM) today announced that its 54%-owned subsidiary, ASM Pacific Technology, Ltd. (Stock Exchange in Hong Kong:0522) received repeat, volume orders for its award winning Eagle gold wire bonder from three customers who made their initial purchases in the fourth quarter of 2001. The Company also received an initial "Eagle" gold wire bonder order from one of the world's top three semiconductor packaging companies.
The volume purchasers include one of the world's leading Ball Grid Array (BGA) assemblers based in Taiwan for 60 sets of Eagle gold wire bonders for shipment within these two months. According to Patrick Lam, Managing Director of ASM Pacific Technology, Ltd., "BGA assembly requires the very fine pad pitch capabilities for high-speed volume production that is provided by our Eagle gold wire bonder. These repeat orders reflect our customer's satisfaction with ASMPT's leading-edge bonder technology for volume production of their more difficult BGA devices."
In addition to the follow-on volume purchases, ASMPT also won an initial bonder order from one of the top packaging companies for its factory in Malaysia. All machines have already been installed and are currently running volume production for fine pitch devices.
Introduced in late 2000, the Eagle gold wire ball bonder has 35 micron pad pitch capability, and offers customers a favorable price/performance ratio over existing industry models. ASMPT's Eagle gold wire bonder was awarded a Semiconductor International magazine Editors' Choice Best Product Award in 2001. In 1998, the Company's predecessor AB339 gold wire bonder received this prestigious award, given to companies whose products make a difference in semiconductor manufacturing.
About ASM
ASM International N.V. has headquarters in Bilthoven, the Netherlands. ASM International is a global company, servicing one of the most important and demanding industries in the world. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. ASM International's subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging through their facilities in the United States, Europe, Japan and Asia. ASM International's common shares trade on Nasdaq (symbol ASMI) and the Euronext Stock Exchange in Amsterdam (symbol ASM). For more information, visit ASM's Website at http://www.asm.com
ASM Pacific Technology, Ltd., with headquarters in Hong Kong, has operations in Shenzhen China, Singapore and Malaysia. It is a dominant global supplier of a full line of assembly and packaging equipment for the semiconductor industry. It also supplies the Photonics and Optoelectronics markets. With its strong financial strength and R&D resources, ASMPT offers its customers total solutions in process innovation, package development and factory automation. ASMPT is 54% owned by ASM International N.V. ASM Pacific Technology, Ltd. common shares trade on the Hong Kong Stock Exchange under the symbol: 0522. For more information, visit ASMPT's Web site at http://www.asmpacific.com.
Safe Harbor Statement under the US Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are 'forward-looking' statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the 'forward-looking' statements. These include, but are not limited to economic conditions and trends in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation, commercial and economic disruption due to terrorist activity, armed conflict or political instability and other risks indicated in filings from time to time with the U.S. Securities and Exchange Commission, including the Company's Forms 20-F and Form 6-K as filed.