BILTHOVEN, THE NETHERLANDS -
May 29, 2002 - ASM International N.V. (Nasdaq: ASMI and the Euronext Stock Exchange in Amsterdam: ASM) announced that its 54%-owned subsidiary, ASM Pacific Technology, has received an order for Eagle gold wire ball bonders from Amkor Technology, Inc. This follows the recent Letter of Intent and equipment shipment announced in April 2002.The new order schedules delivery through June 2002. The Eagle gold wire ball bonders will be used at Amkor's Korea facility to support their advanced semiconductor packaging capability.
Introduced in late 2000, the Eagle gold wire ball bonder has 35 micron pad pitch capability, and offers a favorable price/performance ratio over existing industry models. ASMPT's Eagle gold wire bonder was awarded a Semiconductor International magazine Editors' Choice Best Product Award in 2001. In 1998, the Company's predecessor AB339 gold wire bonder received this prestigious award, given to companies whose products make a difference in semiconductor manufacturing.
In May 2002, ASM Pacific Technology introduced its latest series, the Eagle 60 gold wire bonder with 20-25% higher productivity and enhanced ultra fine 35 micron pad pitch bonding capabilities.
About ASM
ASM International N.V. has headquarters in Bilthoven, the Netherlands. ASM International is a global company, servicing one of the most important and demanding industries in the world. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. ASM International's subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging through their facilities in the United States, Europe, Japan and Asia. ASM International's common shares trade on Nasdaq (symbol ASMI) and the Euronext Stock Exchange in Amsterdam (symbol ASM). For more information, visit ASM's Web site at http://www.asm.com
ASM Pacific Technology, Ltd., with headquarters in Hong Kong, has operations in Shenzhen China, Singapore and Malaysia. It is a dominant global supplier of a full line of assembly and packaging equipment for the semiconductor industry. It also supplies the Photonics and Optoelectronics markets. With its strong financial strength and R&D resources, ASMPT offers its customers total solutions in process innovation, package development and factory automation. ASMPT is 54% owned by ASM International N.V. ASM Pacific Technology, Ltd. common shares trade on the Hong Kong Stock Exchange under the symbol: 0522. For more information, visit ASMPT's Web site at http://www.asmpacific.com.
Safe Harbor Statement under the US Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to economic conditions and trends in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation, commercial and economic disruption due to terrorist activity, armed conflict or political instability and other risks indicated in filings from time to time with the U.S. Securities and Exchange Commission, including the Company's Forms 20-F and Form 6-K as filed.