Newport Corporation's MRSI-5005 Advanced Packaging Work Cell Combines Flip Chip Bonding and Precise GaAs Handling


NORTH BILLERICA, Mass., July 12, 2002 (PRIMEZONE) -- MRSI Group, a subsidiary of Newport Corporation (Nasdaq:NEWP), today announced that it will exhibit its enhanced MRSI-5005 Advanced Packaging Work Cell at SEMICON West 2002 in Booth No. 11035 in McEnery Hall at the San Jose Convention Center July 17 - 19, 2002.

The MRSI-5005 Advanced Packaging Work Cell has become a recognized industry standard for a wide range of applications, including communications, automotive, radar and aerospace. The system, which combines delicate Gallium Arsenide (GaAs) die handling and flip chip bonding, can be configured for several component attachment technologies and applications such as Radio Frequency (RF) modules, microwave modules, millimeter-wave modules, and Micro Electro Mechanical Systems (MEMS). The high accuracy and repeatability of the work cell improves yield and reduces the production time required for the manufacturing of these advanced devices. For thermal compression flip bonding, the MRSI-5005 orients the die utilizing an upward-facing camera with integrated vision and application-specific lighting and optics. The die is then placed using a programmable controlled contact force. The system supports a broad range of forces further increasing its versatility.

The MRSI-5005 offers features that include high accuracy placement (better than +/- 5 microns), 360 degree random die orientation, substrate alignment (global and local), programmable controlled force, delicate part handling, and automatic tip changing. The system can accept parts in cassette-to-cassette handling mode, wafer pick up, waffle packs, gel packs or tape feeders.

Neil Srivastava, vice president and general manager of MRSI Group, said: "Electronic packaging must continually evolve to meet stringent consumer demands. Increasingly, this means that the die bonding process involves a higher level of sophistication. The MRSI-5005 provides an industry-leading solution for thermal compression flip chip bonding of advanced semiconductor devices. It is a further technology advancement at a time when the microelectronics industry is becoming even more reliant on process quality, higher yields and lower costs. The enhancements we have made to the MRSI-5005 further underscore our commitment to providing key enabling technology for semiconductor packaging, as the trend toward chip scale packaging use increases."

Customers and investors who are also interested in Newport's front-end automation products are invited to view them at SEMICON West 2002 from July 22 - 24, 2002 at San Francisco's Moscone Convention Center, Booth 436 in South Hall.

MRSI Group, a wholly owned subsidiary of Newport Corporation, is a leading supplier of dispense and assembly systems for the semiconductor, microelectronics and electronic packaging industries.

For more information on MRSI-5005, go to www.newport.com/photonics/Products/Die_Bonding_and_Dispense/. Information about Newport Corporation's other products is available on the company's Web site at www.newport.com.

About Newport Corporation

Newport Corporation is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. The company provides components and integrated subsystems to manufacturers of semiconductor processing equipment, advanced automated assembly and test systems to manufacturers of communications and electronics devices, and a broad array of high-precision components and instruments to commercial, academic and government customers worldwide. Newport's innovative solutions leverage its expertise in precision robotics and automation, sub-micron positioning systems, vibration isolation and optical subsystems to enhance the capabilities and productivity of its customers' manufacturing, engineering and research applications. Newport is part of the Standard & Poor's Midcap 400 Index and the Russell 2000 Index.

The statements in this news release made by Neil Srivastava are forward-looking statements that involve a number of risks and uncertainties. As discussed in Newport's Annual Report on Form 10-K for the year ended December 31, 2001, assumptions relating to the foregoing involve judgments with respect to various matters, all of which are difficult or impossible to predict accurately and many of which are beyond the control of Newport. Although Newport believes that the assumptions underlying the forward-looking statements are reasonable, any of the assumptions could prove inaccurate and, therefore, there can be no assurance that the results contemplated in forward-looking statements will be realized. In light of the significant uncertainties inherent in the forward-looking information included herein, the inclusion of such information should not be regarded as a representation by Newport or any other person that Newport's objectives or plans will be achieved. Newport undertakes no obligation to revise the forward-looking statements contained herein to reflect such events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.


            

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