Microsemi Introduces Two New Compact High Voltage Schottky Barrier Rectifiers




        -- Package Doubles Power Density, Improves Thermal Ratings
        -- Provides Small, Low Profile Surface Mount Footprint

IRVINE, Calif., Dec. 21, 2004 (PRIMEZONE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high reliability semiconductors, has announced two new high voltage Schottky barrier rectifiers in a compact PowerDI(tm)5 package that provides twice the power density of conventional packages.

Designated the UPDS3200(tm) and UPDS5100H(tm) Schottky barrier rectifiers, the new devices are rated at 3 amps/200volts and 5 amps/100volts/low leakage respectively. Typical applications range from notebook computers to industrial ballasts and numerous Schottky diode applications where density and reliability are the design drivers.

The new high voltage devices employ the PowerDI(tm)5 packaging technology Microsemi recently licensed from Diodes Incorporated (Nasdaq:DIOD) to extend its portfolio of high reliability components for commercial applications among Microsemi's customer base and served markets.

In addition to doubling the power density found in standard SMC and DPAK packages, Microsemi's new high-voltage devices provide up to 50% lower thermal resistance in environmentally friendly RoHS compliant packages that contain no Lead, Bromide or Antimony. The package measures 1.1mm high, with a footprint area of only 26.7mm square.

"These new devices allow us to extend the many benefits our customers enjoy with Microsemi's patented Powermite(r) technology in their lower voltage applications," said Mick McKeighan, Vice President and General Manager of Microsemi's Scottsdale, Arizona, operation. "Low thermal resistance and high power density are key in power management and DC to DC applications," he said.

The UPDS3200(tm) and UPDS5100H(tm) Schottky barrier rectifiers--unit priced at$0.80 in 10K quantities--are available for immediate sampling and volume delivery. Complete technical information is available on the Microsemi web site, www.Microsemi.com. Samples can be requested through this site, from Microsemi sales representatives, or through Microsemi's distribution channel.

About Microsemi

Microsemi is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, military/aerospace and satellite, notebook computers and monitors, automotive and mobile connectivity applications.

More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com.

About Diodes Incorporated

Diodes Incorporated (Nasdaq:DIOD) is a leading manufacturer and supplier of high-quality discrete semiconductor products, serving the communications, computer, industrial, consumer electronics and automotive markets. The Company operates two Far East subsidiaries, Diodes-China (QS-9000 & ISO-14001 certified) in Shanghai and Diodes-Taiwan (ISO-9000 certified) in Taipei. Diodes-China's manufacturing focus is on surface-mount devices destined for wireless devices, notebook computers, pagers, PCMCIA cards and modems, among others. Diodes-Taiwan is an Asia-Pacific sales, logistics and distribution center. The Company's newly acquired 5" wafer foundry, Diodes-FabTech (QS-9000 certified, specializes in Schottky products and is located just outside Kansas City, Missouri. The Company's ISO-9000 corporate sales, marketing, engineering and logistics headquarters is located in Southern California. For further information visit the Company's website at http://www.diodes.com.

Powermite(r) is a trademark of Microsemi Corporation PowerDI(tm)5 is a trademark of Diodes Incorporated

PLEASE READ THE FOLLOWING FACTORS THAT CAN MATERIALLY AFFECT MICROSEMI'S FUTURE RESULTS.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, the hiring and retention of qualified personnel in a competitive labor market, acquiring and integrating new operations or assets, closing or disposing of operations or assets, rapidly changing technology and product obsolescence, the potential inability to realize cost savings or productivity gains and to improve capacity utilization, potential cost increases, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, results of in-process or planned development or marketing and promotional campaigns, changes in demand for products, difficulties foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, business disruptions, epidemics, disasters, wars or potential future effects of the tragic events of September 11, variations in customer order preferences, fluctuations in market prices of the company's common stock and potential unavailability of additional capital on favorable terms, difficulties in implementing company strategies, dealing with environmental matters or litigation, difficulties in determining and maintaining adequate insurance coverage, difficulties protecting patents and other proprietary rights, inventory obsolescence and customer qualification of products, manufacturing facilities and processes. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K or subsequent Forms 10-Q and 8-K filed by Microsemi with the SEC. Additional risk factors shall be identified from time to time in Microsemi's future filings. Microsemi does not undertake to supplement or correct any information in this release that is or becomes incorrect.

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