What: eSilicon, along with other leading technologists, will discuss the feasibility of stacked-die 3-D packaging for the future When: Tuesday, February 2, 2010 10:10 - 11:40 AM Where: DesignCon 2010 Santa Clara Convention Center Ballroom H Who: Moderator: Ed Sperling, Chip Design/SLD Panelists: Rajiv Maheshwary, Synopsys Javier DeLaCruz, eSilicon Glenn Daves, Freescale Semiconductor Carey Robertson, Mentor GraphicsPanel Abstract While debate rages over when Moore's Law hits a technology wall, a few enterprising technologists have moved beyond debate and are looking at stacked die or 3-D packaging as the path to future functionality. And while stacked die technology has proven feasible, it may be the business aspects of bringing this paradigm to fruition that prove the most challenging. Stacked die, or 3-D device technology, is the processes of integrating up to three die within a single semiconductor package. Such an approach makes it possible to mix and match lithographic geometries. But the question arises: Who is going to put it all together so that all parties in the supply chain can make money? The panel will address strategic questions like: What pieces are missing for critical success? Who will benefit the most from the 3-D approach? And if the companies who will benefit the most are not paying for the required research, who will pay and what is in it for them? About eSilicon eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume chip production. The company delivers application specific integrated circuits (ASICs) to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon -- Enabling Your Silicon Success™. For more information, please visit www.esilicon.com. eSilicon and the eSilicon logo are registered trademarks, and Enabling Your Silicon Success is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners
Contact Information: For more information or to schedule a meeting with eSilicon at DesignCon, contact: Susan Cain Cain Communications 503-538-2747 Kalar Rajendiran eSilicon Corporation 408-616-4625