ANDOVER, Mass. and OTTAWA, Aug. 2, 2010 (GLOBE NEWSWIRE) -- SiGe Semiconductor, Inc., a leading provider of highly integrated RF semiconductor front end solutions that enable wireless connectivity across a wide range of applications, today announced that it has filed a registration statement on Form S-1 with the Securities and Exchange Commission for a proposed initial public offering of its common stock. The number of shares to be offered and the price range for the offering have not yet been determined.
Barclays Capital Inc., Deutsche Bank Securities Inc. and Jefferies & Company, Inc. are acting as joint book-running managers for the offering. Canaccord Genuity Inc., Needham & Company, LLC and Raymond James & Associates, Inc. are acting as co-managers for the offering.
When available, a copy of the preliminary prospectus may be obtained from Barclays Capital Inc., c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by calling 888-603-5847 or by emailing barclaysprospectus@broadridge.com; from Deutsche Bank Securities Inc., 100 Plaza One, Jersey City, New Jersey 07311, Attn: Prospectus Department, by calling 800-503-4611 or by emailing prospectus.cpdg@db.com; or from Jefferies & Company, Inc., 520 Madison Ave., 12th Floor, New York, NY 10022, Attn: Equity Syndicate Prospectus Department, by calling 877-547-6340 or by emailing Prospectus_Department@Jefferies.com.
A registration statement relating to the offered shares has been filed with the Securities and Exchange Commission but has not yet become effective. The offered shares may not be sold nor may offers to buy be accepted prior to the time the registration statement becomes effective. This news release shall not constitute an offer to sell or the solicitation of an offer to buy, nor shall there be any sale of, the offered shares in any state in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state.
About SiGe Semiconductor
SiGe Semiconductor is a leading provider of highly integrated RF semiconductor front end solutions that enable wireless connectivity across a wide range of applications. Our innovative solutions integrate multiple RF functions into a single semiconductor device to deliver an optimal combination of performance, power output and efficiency, and size. Our predominant use of standard silicon based processes and fabless manufacturing model enables us to achieve high levels of functional integration, leverage the economies of scale of high volume manufacturing technology, maintain low costs and accelerate our time-to-market. We have shipped more than 500 million front end solutions since our inception, primarily consisting of Wi-Fi™ front end modules and power amplifiers.
About SiGe Semiconductor's Lead-Free Initiative The use of lead in the design and manufacture of electronic products is an increasing environmental concern. In support of industry-wide initiatives to protect the environment, all SiGe Semiconductor, Inc. products we ship today are lead-free and RoHS compliant.
This news release may contain certain forward-looking statements. All statements, other than statements of historical fact, included herein are forward-looking statements that involve various risks and uncertainties. There can be no assurance that such statements will prove to be accurate and actual results and future events could differ materially from those anticipated in such statements. Forward-looking statements are based on the estimates and opinions of management on the date the statements are made, and SiGe Semiconductor, Inc. does not undertake an obligation to update forward-looking statements should conditions or management's estimates or opinions change.