- Transient Voltage Suppression (TVS) Devices with Unique Packaging Technology Meet New Avionics Safety Standards
- PLAD Packaging on Display at Electronica 2010, November 8-10, 2010-Hall A4, Booth #525
IRVINE, Calif., Nov. 9, 2010 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, today announced that its family of Plastic Large Area Device (PLAD)™ surface-mount transient voltage suppressors (TVS) enables avionics systems to meet new safety standards required for today's carbon composite-skinned aircraft.
Microsemi's PLAD TM packaging improves surge protection, preventing the disruption of digital signal processing, component damage and interruption of function due to the indirect effects of lightning. These new multiple-burst lightning-protection requirements were specified by the Radio Technical Committee for Aeronautics in the United States, and the European Civil Aviation Electronic organization.
"Our end customers in the avionics market must meet the strictest standards of safety and security," said Kare Karlsen, Microsemi's Executive Vice President of its High Reliability Group. "Our ability to deliver compliance is further proof of Microsemi's commitment to provide a unique advantage to customers who value power, precision, security and reliability."
Modern military aircraft, such as the F-22, use composites for at least a third of their structures, and commercial aircraft such the Boeing 787 use composite materials for nearly all exterior surfaces except for the leading edges of the wings, the stabilizers and the engine pylons. Composite-skinned airframes have less intrinsic ability than earlier aluminum airframes to keep a large lightning strike from damaging the aircraft and its on-board electronics. The company's top avionics customers have selected its TVS solutions to ensure safety and reliability in critical and essential system functions performed in the engine control equipment, ignition systems and on-board aerial cameras.
Microsemi's PLAD technology is the first to enable more effective surface-mount TVS packaging for both 15 kW and 30 kW devices. It combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to through-hole devices, and is compatible with standard assembly automation.
Come see Microsemi TVS devices, featuring patented PLAD packaging live at Electronica 2010, Stand A4.525, at the New Munich Trade Faire in Munich, November 9-12.
Technical Details
Microsemi's PLAD TVS device offering include the PLAD15KP series rated at 15 kilowatts (kW) and the PLAD30KP series rated at 30 kW. The devices feature standoff voltage of 7 volts (V) to 200V for the PLAD15KP series and 14V to 400V for the PLAD30KP series. Each of the TVS family members features ultra-low thermal resistance calculated to 0.2 degrees C/W and 0.3 degrees C/W respectively, and customers can choose between unidirectional and bidirectional construction for both DC and AC applications. Microsemi's TVS offering for avionics applications also includes the option of 100 percent screening to ensure the highest levels of reliability for plastic devices.
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at www.microsemi.com http://www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the family of Plastic Large Area Device (PLAD)™ surface-mount transient voltage suppressors (TVS) that enable avionics systems to meet new safety standards required for today's carbon composite-skinned aircraft, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.