IRVINE, Calif., June 21, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a design guide for developing next-generation high-voltage, high-power systems based on the company's unique digital radio frequency (DRF) family of hybrid modules. These systems are used in applications including semiconductor processing, LCD glass coating, solar cell manufacturing, optical device and architectural glass coating, hazardous gas treatment, CO2 laser excitation, MRI RF amplifiers, RF scalpels and induction heating systems.
The modules combine RF driver ICs and power MOSFETs in a single, high-performance package capable of delivering 1 to 3 kilowatts (kW) of power at frequencies up to 40 megahertz (MHz). The design guide also provides system developers with RF design techniques related to component selection, matching network design, output power optimization, efficiency maximization, cooling and packaging, as well as detailed recommendations related to circuit topologies required for building a complete RF generator.
"Our DRF product suite delivers substantial benefits as compared to conventional low-voltage RF systems," said Glenn Wright, director of marketing, MOSRF products, at Microsemi. "These benefits include the ability to solve difficult design challenges to reduce system size, increase power density, improve reliability and reduce overall system cost for a variety of industrial, scientific and medical applications."
Microsemi's DRF product family combines up to two RF drivers ICs, two RF power MOSFETs and associated decoupling capacitors in a single package. The close proximity of the driver IC and MOSFET greatly reduces circuit inductance while improving performance as compared to alternative solutions using discrete components, and enables a variety of circuit configuration and system topologies. Designed to deliver continuous power, Class D and E, and pulsed-power applications, the modules are capable of launching up to 3kW of RF power while requiring only 5V logic level input signals. They also use Microsemi's unique flangeless packaging capability to reduce cost and improve performance as compared to alternative legacy solutions.
Microsemi's DRF design guide and other development tools and support offerings are available now, including SPICE models, reference design kits and application notes.
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and commercial; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, configurable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Irvine, Calif., and has more than 2,800 employees globally.Learn more at www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the design guide for developing next-generation high-voltage, high-power systems based on the company's DRF family of hybrid modules, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.