Microsemi Introduces Replacement Solution for Micron Technology EOL Package Used With TI Processors

Space-Saving Package Eliminates Board Redesign and Protects Design-Wins

Irvine, California, UNITED STATES


IRVINE, Calif., July 13, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors. The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today. The new memory solution is compatible with TI processor families that are enclosed in Micron Technology's end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming board redesign efforts and protect current design-wins.

The new Microsemi component family is compatible with TI's Sitara™, OMAP™, and DaVinci™ processors. The initial product has the same footprint as Micron's MT29C2G24MAKLACG-XIT, providing a replacement for the EOL package. Additional features include LPDDR and LPDDR+ flash and are specifically designed to support TI OMAP35xx, AM37x and DM37x processors.

Key Features

  • Extends the life of memory devices in the 152BGA package currently EOL by Micron Technology; provides same form, fit, and function
     
  • Avoids the need for PCB redesign and protects established design wins
     
  • Supports TI processors that employs the use of a PoP memory support chip

Microsemi's MS29C2G24MAKLA1-XI (OMAP MCP) memory houses 2G (x16) SLC NAND Flash and 1G (x32) Mobile LPDDR MCP combination memory with separate interfaces in a 14mm x 14mm, 152 BGA (ball grid array) package with a 0.65mm pitch. It features 1.8 volt flash and 1.8V LPDDR with an industrial temperature range of -40°C to +85°C and low voltage operation. The company plans to offer 4G-2G and 2G LPDDR versions later this year.

For more information, please contact your local Microsemi sales representative.

About Microsemi

Microsemi Corporation (Nasdaq:MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and commercial; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Irvine, Calif., and has more than 2,800 employees globally.Learn more at www.microsemi.com.

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Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Sitara, OMAP and DaVinci are trademarks of Texas Instruments. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

Safe Harbor

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the new Microsemi multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.



        

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