Microsemi Expands SmartFusion cSoC Offering for Industrial and Military Applications

New Leaded 208-PQFP Package Reduces PCB Manufacturing and Debugging Costs

Irvine, California, UNITED STATES


ALISO VIEJO, Calif., Aug. 31, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customizable system-on-chip (cSoC) family is now available in a leaded 208-PQFP package. The new leaded package reduces overall printed circuit board (PCB) manufacturing and debugging costs, as it requires fewer PCB layers compared to ball grid array and chip scale packages. The PQ208 is designed for a variety of industrial and military applications, including motor and motion control, gaming machines, solar inverters, military avionics, missiles and weapons.

"Launching the SmartFusion cSoC in 2010 has expanded our customer base, and a percentage of our new customers expressed the need for the PQ208 package," said Rich Kapusta, vice president terrestrial products, SoC Products Group at Microsemi. "We will continue to listen to our customers and provide a robust range of solutions to suit their exact needs—from leading edge, chip scale packaging to traditional leaded packages."

As the newest option in Microsemi's cSoC portfolio, the PQ208 features an ARM® Cortex-M3™ based 32-bit microcontroller with up to 512KB of flash memory, up to 500K gates of field programmable gate array (FPGA) and programmable analog. It also boasts 10/100 Ethernet; external memory controller with I2C, SPI and UART interfaces; up to 113 user input/outputs (I/Os) including FPGA; microcontroller GPIO and analog I/O. For more information, visit www.microsemi.com/soc/.

Microsemi's SmartFusion cSoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor and programmable analog, enabling full customization, IP protection and ease-of-use. Based on Microsemi's proprietary flash process, SmartFusion devices are ideal for hardware and embedded designers who need a highly integrated SoC that provides more flexibility than traditional fixed-function microcontrollers, and significantly reduces the cost of soft processor cores on traditional FPGAs.

About Microsemi

Microsemi Corporation (Nasdaq:MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally.Learn more at www.microsemi.com.

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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the availability of its SmartFusion® customizable system-on-chip (cSoC) device in a leaded 208-PQFP package, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.


        

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