SORAA: Tri-LED and Lightchip Reverse Costing Analysis


Dublin, Oct. 3, 2013 (GLOBE NEWSWIRE) -- Research and Markets ( has announced the addition of the "SORAA: Tri-LED and Lightchip Reverse Costing Analysis" report to their offering.

SORAA has recently released the first GaN on GaN LED in a 50W halogen equivalent MR16 lamp with several new features.

SORAA smartly used the GaN characteristics like the optical transparency and the high electrical and thermal conductivity to create a unique vertical structure for these LEDs. The layers deposited by epitaxy are very thin.

A high current density per sq cm is obtained, estimated at 120A / sq cm, 4x more than sapphire LED.

The SORAA LEDs have a triangular shape to limit the internal reflection of the light and thus increase the light extraction.

An original silicon package with a multilayer mirror is used to increase the light extraction of the LED lamp.

This report provides a complete teardown of the LED and the package with:

- Detailed photos
- Material analysis
- Detailed structure of dies and package
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:


1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Companies Profile
- SORAA Profile

3. Lightchip Package and Tri-LED Characteristics
- Lightchip Characteristics

4. Physical Analysis
- Physical Analysis Methodology
- SORAA MR16 Lamp
- Lightchip Package Views & Dimensions
- Lightchip Package Opening
- Lightchip Package Cross-Section
- Phosphor
- Tri-LED Assembly
- Lightchip Package Characteristics
- Tri-LED Views & Dimensions
- Cathode
- Tri-LED Singulation
- Epitaxy
- Tri-LED Thickness

5. Manufacturing Process Flow
- Global Overview
- Tri-LED Fabrication Unit
- Tri-LED Process Flow
- Lightchip Fabrication Unit
- Lightchip Process Flow

6. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Hypotheses
- Tri-LED Front-End Cost
- Tri-LED Wafer Cost
- Tri-LED Cost per process steps
- Tri-LED Equipment Cost per Family
- Tri-LED Material Cost per Family
- Back-End : Probe and cleaving Cost
- Lightchip Packaging Cost
- Lightchip Wafer Cost
- Final Assembly Cost
- Component Cost & Price

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