Alliance Memory Announces New Dual-Die 8Gb DDR3L SDRAMs in 78-Ball and 96-Ball FBGA Packages

Devices Provide Drop-in Replacement for Micron EOL Single-Die 8Gb DDR3L SDRAMs


SAN CARLOS, Calif., April 25, 2019 (GLOBE NEWSWIRE) -- Alliance Memory today introduced new dual-die 8Gb DDR3L SDRAMs that are pin-for-pin drop-in replacements for and fully compatible with end-of-life, single-die 8Gb DDR3Ls from Micron Technology Inc.

Alliance Memory Part NumberConfigurationPackage Type
AS4C1G8D3LA8 banks x 128M x 878-ball FBGA
AS4C512M16D3LA8 banks x 64M x 1696-ball FBGA

“When Micron announced a last-time buy date for some of its most popular 8Gb DDR3L single-die SDRAMs, we responded by offering the original Micron part numbers, along with Alliance Memory identical replacements of the monolithic devices,” said David Bagby, president and CEO of Alliance Memory. “In keeping with our commitment to supporting our customers’ legacy SDRAM needs, we’re excited to now announce the immediate availability of dual-die-package 8Gb DDR3L SDRAMs for long-term support and new designs.”

Featuring a DDR architecture, the AS4C1G8D3LA and AS4C512M16D3LA provide speed of 10ns, extremely fast data rates of 1866Mbps, and clock rates of 933MHz. Operating from a single +1.35V power supply, with backward compatibility to 1.5V, the SDRAMs are optimized for main memory applications in laptops, desktops, servers, and embedded / industrial designs. The devices are available in commercial (0°C to +95°C), industrial (-40°C to +95°C), and automotive (-40°C to +105°C) temperature ranges.

The AS4C1G8D3LA and AS4C512M16D3LA support sequential and interleave burst types with read or write burst lengths of 4 or 8. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh. RoHS-compliant, the devices are lead (Pb)- and halogen-free.

Learn more about Alliance Memory’s offering of single- and dual-die 8Gb DDR3L SDRAMs at https://www.alliancememory.com/micron-eol-8g-ddr3l-sdrams-now-available-direct-from-alliance-memory/.

Samples and production quantities of the dual-die AS4C1G8D3LA and AS4C512M16D3LA are available now, with lead times of six to eight weeks. Pricing depends on density, configuration, and order size.

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes DRAMs and SRAMs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in San Carlos, California, and regional offices in Europe, Asia, Canada, and South America. More information about Alliance Memory is available online at www.alliancememory.com.

All trademarks appearing herein are the property of their respective owners.

Editor resources:

Product photo:
https://www.flickr.com/photos/alliancememory/albums/72157704747742752

Link to more information:
https://www.alliancememory.com/micron-eol-8g-ddr3l-sdrams-now-available-direct-from-alliance-memory/

Agency Contact:
Bob Decker
Redpines
+1 415 409 0233
bob.decker@redpinesgroup.com
Alliance Memory Contact:
Kim Bagby
CFO
+1 650 610 6800
kim@alliancememory.com