PUNE, India, July 03, 2019 (GLOBE NEWSWIRE) -- Global Solder Paste Inspection (SPI) System Industry was valued at USD 231 Million in the year 2018. Global Solder Paste Inspection (SPI) System Industry is further estimated to grow at a CAGR of 4.5% from 2018 to 2025 to reach USD 331 Million. Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of SPI, you can reduce the defects related to soldering by a considerable amount.
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The global Solder Paste Inspection (SPI) System industry is segmented on the basis of type, application, and geography. Based on type, the industry is classified into 2D Automated Solder Paste Inspection, and 3D Automated Solder Paste Inspection. Based on product type, the industry is divided into In-line SPI System, Off-line SPI System, and others.
Based on End User, the Industry is classified in to Automotive Electronics, Consumer Electronics, Aerospace, Industrial Electronics, Semiconductor, Optoelectronics Industry, and Others. Based on region, it is analyzed across North America, Asia-Pacific, Europe, and LAMEA.
Development of the sustenance bundling industry drives the Solder Paste Inspection (SPI) System Industry. Expanding utilization of sustenance bundling arrangements, for example, lidding films, pockets and sacks, covers, and wraps over the globe is foreseen to drive the Solder Paste Inspection (SPI) System amid the conjecture time frame. Ascend in bundling of meat, poultry, and fish is a noteworthy driver of the Solder Paste Inspection (SPI) System Industry in nations in Middle East and Africa (MEA). Producers of Solder Paste Inspection (SPI) System over the globe are creating sans chlorine options for bundling application to decrease the ecological effect. Producers are occupied with research exercises to create practical options for Solder Paste Inspection (SPI) System to increment in shopper mindfulness and stringent government strategies in regards to transfer of disposed of films.
Major market players operating in the global Solder Paste Inspection (SPI) System industry include Koh Young, CyberOptics Corporation, MirTec Ltd, PARMI Corp, Viscom AG, ViTrox, Vi TECHNOLOGY, Test Research, Inc (TRI), Mek (Marantz Electronics), CKD Corporation, Pemtron, SAKI Corporation, Caltex Scientific, ASC International, Sinic-Tek Vision Technology, Machine Vision Products (MVP), Shenzhen JT Automation Equipment, Jet Technology, and others. Company details are provided as per client requirements.
Solder Paste Inspection (SPI) System Industry Segmentation:
By Product Type
- In-line SPI System
- Off-line SPI System
By Type
- 2D Automated Solder Paste Inspection
- 3D Automated Solder Paste Inspection
By End User Industry
- Automotive Electronics
- Consumer Electronics
- Aerospace
- Industrial Electronics
- Semiconductor
- Optoelectronics Industry
- Other
Solder Paste Inspection (SPI) System Industry, By Region
North America
- U.S.
- Rest of North America
Europe
- U.K.
- Germany
- Switzerland
- RoE
Asia Pacific
- China
- Japan
- RoAPAC
RoW
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