Portland, OR, Oct. 14, 2022 (GLOBE NEWSWIRE) -- According to the report published by Allied Market Research, the global semiconductor bonding market generated $888.6 million in 2021, and is projected to reach $1279.40 million by 2031, growing at a CAGR of 3.6% from 2022 to 2031. The report offers a detailed analysis of the top winning strategies, evolving market trends, market size and estimations, value chain, key investment pockets, drivers & opportunities, competitive landscape and regional landscape. The report is a useful source of information for new entrants, shareholders, frontrunners and shareholders in introducing necessary strategies for the future and taking essential steps to significantly strengthen and heighten their position in the market.
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Report Coverage & Details:
| Report Coverage | Details |
| Forecast Period | 2022–2031 |
| Base Year | 2021 |
| Market Size in 2021 | $888.6 million |
| Market Size in 2031 | $1279.40 million |
| CAGR | 3.6% |
| No. of Pages in Report | 290 |
| Segments Covered | Type, process type, bonding technology, application, and region. |
| Drivers | Increase in the standard of living |
| Increase in demand for miniature electronic components | |
| Opportunities | increase in the adoption of stacked die technology in IoT devices |
| surge in demand for electric and hybrid vehicles |
COVID-19 Scenario:
- The outbreak of COVID-19 has had a negative impact on the growth of the global semiconductor bonding market, owing to the occurrence of lockdowns in various countries across the globe.
- Lockdowns resulted in the closure of various manufacturing facilities, including those of semiconductors and automotives, which adversely impacted the growth of the market.
- In addition, there was shortage of workforce and essentials raw materials due to strict trade restrictions as imposed by numerous governments.
- These restrictions were imposed by the government so as to curb the spread of the virus during the pandemic. However, the market is expected to recoup soon.
Get Detailed COVID-19 Impact Analysis On The Semiconductor Bonding Market: https://www.alliedmarketresearch.com/request-for-customization/31982
The report offers detailed segmentation of the global semiconductor bonding market based on type, process type, bonding technology, application, and region. The report provides a comprehensive analysis of every segment and their respective sub-segment with the help of graphical and tabular representation. This analysis can essentially help market players, investors, and new entrants in determining and devising strategies based on fastest growing segments and highest revenue generation that is mentioned in the report.
Based on type, the wafer bonder segment held the dominating market share in 2021, holding around two-fifths of the global semiconductor bonding market share, and is expected to maintain its leadership status during the forecast period. The die bonder segment, on the other hand, is expected to cite the fastest CAGR of 4.18% during the forecast period.
Based on process type, the die to die bonding segment held the largest market share in 2021, holding more than half of the global semiconductor bonding market share, and is expected to maintain its leadership status during the forecast period. The Die To Wafer Bonding segment, on the other hand, is expected to cite the fastest CAGR of 4.22% during the forecast period. The report also includes segments such as die to wafer bonding and wafer to wafer bonding.
Based on application, the LED segment held the largest market share in 2021, holding more than one-third of the global semiconductor bonding market share, and is expected to maintain its leadership status during the forecast period. The 3D NAND segment, on the other hand, is expected to cite the fastest CAGR of 6.53% during the forecast period.
Based on region, the market across Asia-Pacific region held the largest market share in 2021, holding more than two-fifths of the global semiconductor bonding market, and is expected to maintain its leadership status during the forecast period. In addition, the same region is expected to cite the fastest CAGR of 4.56% during the forecast period. The report also analyses other regions such as Europe, North America, and LAMEA.
The key players analysed in the global semiconductor bonding market report include ASM Pacific Technology, BE Semiconductor Industries N.V., Panasonic Corporation, Fasford Technology, Shinkawa Ltd, EV Group, SUSS MicroTech SE, Kulicke & Soffa Industries, Palomar Technologies, Shibaura Mechatronics, TDK Corporation, Tokyo Electron Limited, Mitsubishi Heavy Industries Machine Tools, Mycronic Group, INTEL Corporation, Skywater Technology, and Tessera Technologies, Inc.
The report analyzes these key players in the global semiconductor bonding market. These market players have made effective use of strategies such as joint ventures, collaborations, expansion, new product launches, partnerships, and others to maximize their foothold and prowess in the industry. The report is helpful in analyzing recent developments, product portfolio, business performance and operating segments by prominent players in the market.
Key Benefits for Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the semiconductor bonding market analysis from 2021 to 2031 to identify the prevailing semiconductor bonding market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the semiconductor bonding market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global semiconductor bonding market trends, key players, market segments, application areas, and market growth strategies.
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Key Market Segments
Type
- Die Bonder
- Wafer Bonder
- Flip Chip Bonder
Proces Type
- Die To Die Bonding
- Die To Wafer Bonding
- Wafer To Wafer Bonding
Bonding Technology
- Die Bonding Technology
- Wafer Bonding Technology
- Wafer Bonding Technology
- Direct and Anodic Wafer Bonding
- Indirect Wafer Bonding
- Wafer Bonding Technology
Application
- RF Devices
- CMOS Image Sensors
- LED
- 3D NAND
- Mems and Sensors
About Us
Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.
Pawan Kumar, the CEO of Allied Market Research, is leading the organization toward providing high-quality data and insights. We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.
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