Global Substrate-Like PCB Market to Reach $5.98 Billion by 2031 at a CAGR of 14.9%


Dublin, Oct. 19, 2022 (GLOBE NEWSWIRE) -- The "Global Substrate-Like PCB Market 2021-2031 by Inspection Technology, Line/Space, Application, and Region: Trend Forecast and Growth Opportunity" report has been added to ResearchAndMarkets.com's offering.

Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP's ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.

In-depth qualitative analyses include identification and investigation of the following aspects:

  • Market Structure
  • Growth Drivers
  • Restraints and Challenges
  • Emerging Product Trends & Market Opportunities
  • Porter's Five Forces

The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account COVID-19 and the Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Region.

Based on Inspection Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Automated Optical Inspection (AOI)
  • Direct Imaging (DI)
  • Automated Optical Shaping (AOS)

Based on Line/Space, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • 25/25 and 30/30 µm
  • Less than 25/25 µm

By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Consumer Electronics
  • Automotive Industry
  • Medical Industry
  • Industrial Use
  • Computing and Communications
  • Other Applications

Geographically, the following regions together with the listed national/local markets are fully investigated:

  • North America (U.S., Canada, and Mexico)
  • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
  • APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
  • South America (Brazil, Chile, Argentina, Rest of South America)
  • MEA (UAE,Saudi Arabia, South Africa and Rest of MEA)

Selected Key Players:

  • Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
  • China Circuit Technology Corporation
  • Compaq Manufacturing Co., Ltd.
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • Kinsus Interconnect Technology Corp
  • Korea Circuit Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • Shenzhen Fastprint Circuit Tech Co., Ltd.
  • Symtek Automation Asia Co., Ltd.
  • TTM Technologies, Inc.
  • Unimicron Technology Corp.
  • Zhen Ding Tech. Group Technology Holding Limited

Key Topics Covered:

1 Introduction

2 Market Overview and Dynamics

3 Segmentation of Global Market by Inspection Technology

4 Segmentation of Global Market by Line/Space

5 Segmentation of Global Market by Application

6 Segmentation of Global Market by Region

7 Competitive Landscape

For more information about this report visit https://www.researchandmarkets.com/r/x1ur78

Attachment

 
Global Substrate-Like PCB (SLP) Market

Contact Data