NEWARK, Del, Feb. 27, 2023 (GLOBE NEWSWIRE) -- As per FMI, the global high-end performance packaging market size reached US$ 3.3 billion in 2022. Global high-end performance packaging demand will rise at 15.9% CAGR between 2023 and 2033.
The high-end performance packaging market value is forecast to reach US$ 17.0 billion by 2033. UHD FO technology type will dominate the market during the assessment period. FMI predicts the UHD FO segment to expand at 15.8% CAGR.
Growing demand for advanced packaging technologies is driving the high-end performance packaging market. Rising trend of miniaturization will boost sales through 2033.
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Increasing adoption of high-performance computing (HPC) will propel high-end performance packaging demand. Further, rising popularity of autonomous vehicles will create growth prospects for the market.
Different high-end performance packaging technologies are being used to design ultra-thin devices. These technologies include Ultra High-Density Fan Out (UHD FO), HBM, etc.
The UHD FO packaging is used in advanced technologies such as 5G, cloud computing, and ADAS. High Bandwidth Memory (HBM) has application in bandwidths above 256 GBps. It reduces power consumption of the circuitry.
Si Interposer finds application in heterogeneous packaging techniques. Foveros by Intel provides 3D stacking solutions that make packaging more efficient. It is designed to incorporate two or more chiplets assembled together.
EMIB and Co-EMIB are used in the high-performance computing applications. They make the whole electronics circuit consume less power and function at a higher pace.
Hence, growing usage of these high-end performance packaging technologies will boost the market.
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Key Takeaways from High-End Performance Packaging Market Report:
- The market for high-end performance packaging is set to reach a massive valuation of US$ 17.0 billion by 2033.
- Global high-end performance packaging demand is set to increase at 15.9% CAGR through 2033.
- By technology, UHD FO segment will expand at 15.8% CAGR during the forecast period.
- Based on application, high performance computing segment will accelerate at 15.7% CAGR.
- The United States high-end performance packaging market will exhibit a CAGR of 15.2%.
- Sales of high-end performance packaging across China will surge at 17.4% CAGR through 2033.
- Japan’s high-end performance packaging market will reach US$ 2.7 billion by 2033.
“Surging applications in high-performance computing and autonomous vehicles will continue to boost the global high-end performance packaging market”, says a lead Future Market Insights analyst.
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Who is Winning?
Leading players operating in the high-end performance packaging market are developing advanced packaging solutions to meet end user demand from several industries. Besides this, they are adopting strategies such as partnerships, collaborations, acquisitions, and mergers.
Key high-end performance packaging companies include Intel, TSMC, ASE, Samsung, Amkor, JCET Group, Tongfu, ADI, AMD, and ARM. These leading high-end performance packaging manufacturers are developing advanced packaging solutions.
For instance,
- In February 2022, Intel Corporation, the United States-based Technology Company announced that it has signed a definitive agreement in order to acquire the Tower Semiconductor.
Get More Insights into High-End Performance Packaging Market
Future Market Insights, in its new offering, presents an unbiased analysis of the High-End Performance Packaging market, presenting historical market data (2018 to 2022) and forecast statistics for the period of 2023 to 2033.
The study reveals extensive growth in High-End Performance Packaging based on technology (UHD FO, HBM, 3DS, Foveros , 3DNAND, Co-EMIB, EMIB, Si interposer, 3D SoC) and application (data center networking, high-performance computing and autonomous vehicles) across several regions.
Global High-End Performance Packaging Market Segmentation
By Technology:
- UHD FO
- HBM
- 3DS
- Foveros
- 3DNAND
- Co-EMIB
- EMIB
- Si interposer
- 3D SOC
By Application:
- Data Center Networking
- High Performance Computing
- Autonomous Vehicles
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
Table of Content
1. Executive Summary | High-End Performance Packaging Market
- Global Market Outlook
- Demand-side Trends
- Supply-side Trends
- Technology Roadmap Analysis
- Analysis and Recommendations
2. Market Overview
- Market Coverage / Taxonomy
- Market Definition / Scope / Limitations
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Explore FMI’s Extensive Coverage in Technology Domain:
Advanced Packaging Market Size: Between 2023 and 2033, there is expected to be significant growth in the global market for advanced packaging, with a CAGR of 7.2%. In 2023, the market is expected to be worth $30.5 billion in US dollars. By 2033, the global market is projected to be worth $61.3 billion.
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RF Interconnect Market Share: The RF interconnect market has been estimated at US$ 31.56 billion in 2023 and is predicted to register a CAGR of 7.5% from 2023 to 2033. The RF interconnect market is predicted to be worth US$ 65.05 billion by 2033.
5G Technology Market Analysis: The demand for 5G technology is expected to increase at a CAGR of 48.3% globally. By 2023, market revenue is predicted to be worth US$ 19.3 billion, and by 2033, it will have increased by US$ 994.8 billion.
Photoelectric Sensors Market Opportunity: The market for photoelectric sensors is expected to increase from US$ 1.84 billion in 2023 to US$ 4.37 billion in 2033, according to Future Market Insights.
About Future Market Insights, Inc :
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