Global System-in-Package (SiP) Technology Market to Reach $58 Billion by 2030

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New York, March 08, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global System-in-Package (SiP) Technology Industry" - https://www.reportlinker.com/p05442625/?utm_source=GNW
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Global System-in-Package (SiP) Technology Market to Reach $58 Billion by 2030

In the changed post COVID-19 business landscape, the global market for System-in-Package (SiP) Technology estimated at US$26 Billion in the year 2022, is projected to reach a revised size of US$58 Billion by 2030, growing at aCAGR of 10.6% over the period 2022-2030. 2.5-D IC, one of the segments analyzed in the report, is projected to record 10.4% CAGR and reach US$27.2 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 2-D IC segment is readjusted to a revised 8% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7.1 Billion, While China is Forecast to Grow at 15.7% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$7.1 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$14 Billion by the year 2030 trailing a CAGR of 15.7% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.7% and 9.4% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.9% CAGR.

Select Competitors (Total 49 Featured)
- Amkor Technology Inc.
- ChipMOS Technologies Inc.
- Fujitsu Limited
- GS Nanotech
- Insight SiP
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Powertech Technologies Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd.
- Si2 Microsystems Private Limited
- STATS ChipPAC Ltd.


Read the full report: https://www.reportlinker.com/p05442625/?utm_source=GNW

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Small Form Factor, High Performance & Energy Efficiency Needs
of Electronics Industry Bolster Demand for System-in-Package
(SiP) Technology
Recent Market Activity
Growing Demand for Miniature and High Performance Electronic
Devices & Systems Drive SiP Market
Developing Countries Offer Growth Prospects
Flip Chip Type of Interconnection Technology Leads SiP
Technology Market
Consumer Electronics Sector Fuels Revenue Growth in SiP Market
Portable Electronic Devices Stir Demand for Flat Packaging
2.5D IC Packaging Technology Dominates SiP Market
Challenges Confronting the SiP Market
System-in-Package (SiP) Technology - Global Key Competitors
Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for
Players Worldwide in 2022 (E)
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS
Amkor Technology, Inc. (USA)
ASE Group (Taiwan)
ChipMOS Technologies Inc. (Taiwan)
Fujitsu Limited (Japan)
GS Nanotech (Russia)
Insight SiP (France)
Intel Corporation (USA)
Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
Kulicke & Soffa Pte Ltd. (Singapore)
Nanium S.A. (Portugal)
O.C.E. Technology Ltd. (Ireland)
Powertech Technologies, Inc. (Taiwan)
Renesas Electronics Corporation (Japan)
Samsung Electronics Co., Ltd. (South Korea)
ShunSin Technology (Zhongshan) Limited (China)
Si2 Microsystems Private Limited (India)
Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
STATS ChipPAC Ltd. (Singapore)
Unimicron Corporation (Taiwan)

3. MARKET TRENDS & DRIVERS
Importance of SiP Technology in Electronics
Rising Demand for High Performance and Compact Consumer
Electronics Drive Growth
List of Select SiP Solutions for Connected Devices
Growing Demand for Smart, Energy Efficient Electronics Provides
Business Case for SiP
Growing Sales of Smartphones Bode Well for SiP Market
Growing Demand for Tablet PCs - A Key Growth Driver
Applications in Set Top Boxes Boosts Demand for SiP Technology
Computing Devices - A Key Growth Driver
IoT Opens New Growth Avenues for SiP
TSVs for Die-to-Die/Die-to-Package Substrate Communication
Advanced Nodes Demand Innovative Package Technologies
PCB Considerations Vital for Using SiP in IoT Systems
WLCSP for Compact Form Factors
Trend Towards Smart Homes Offers Growth Opportunities
Miniaturization of Electronics - A Major Growth Driver for SiP
Need for Compact and High Speed Performance Products Spurs
Market Growth
Shift in Direction towards "More Than Moore’s Law" Benefits the
SiP Market
SMBs Spur the Adoption of SiP
Expanding Applications in Non- Battery Operated Systems Spur
Market Growth
SoC Design Complexities Bring Focus onto SiP
Combined SoC and SiP Technology Gains Increased Demand
Need to Reduce Cost Per Function of ICs Boosts Market Demand
Advanced SiP Packaging Transforming System-Level Integration
Landscape
Wafer-Based Advanced SiP
Laminate-based Advanced SiP
SiP Technology to Impact Fan-In Packaging Platform
Foundries Focus on Offering Turnkey Services with System-in-
Package
Vendors Offer Advanced Capabilities for SiP Design

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Geographic Region - USA,
Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2022 through 2030 and % CAGR

Table 2: World Historic Review for System-in-Package (SiP)
Technology by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2014 through 2021 and % CAGR

Table 3: World 16-Year Perspective for System-in-Package (SiP)
Technology by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa Markets for Years 2014,
2023 & 2030

Table 4: World Recent Past, Current & Future Analysis for
Consumer Electronics by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2022 through 2030 and % CAGR

Table 5: World Historic Review for Consumer Electronics by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2014 through 2021 and % CAGR

Table 6: World 16-Year Perspective for Consumer Electronics by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 7: World Recent Past, Current & Future Analysis for
Telecommunications by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2022 through 2030 and % CAGR

Table 8: World Historic Review for Telecommunications by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2014 through 2021 and % CAGR

Table 9: World 16-Year Perspective for Telecommunications by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 10: World Recent Past, Current & Future Analysis for
Automotive by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2022 through 2030 and % CAGR

Table 11: World Historic Review for Automotive by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 12: World 16-Year Perspective for Automotive by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 13: World Recent Past, Current & Future Analysis for
Aerospace & Defense by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2022 through 2030 and % CAGR

Table 14: World Historic Review for Aerospace & Defense by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2014 through 2021 and % CAGR

Table 15: World 16-Year Perspective for Aerospace & Defense by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 16: World Recent Past, Current & Future Analysis for
Industrial by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2022 through 2030 and % CAGR

Table 17: World Historic Review for Industrial by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 18: World 16-Year Perspective for Industrial by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 19: World Recent Past, Current & Future Analysis for
Other Applications by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2022 through 2030 and % CAGR

Table 20: World Historic Review for Other Applications by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2014 through 2021 and % CAGR

Table 21: World 16-Year Perspective for Other Applications by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 22: World Recent Past, Current & Future Analysis for
2.5-D IC by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2022 through 2030 and % CAGR

Table 23: World Historic Review for 2.5-D IC by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 24: World 16-Year Perspective for 2.5-D IC by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa for Years 2014, 2023 & 2030

Table 25: World Recent Past, Current & Future Analysis for 2-D
IC by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2022 through 2030 and % CAGR

Table 26: World Historic Review for 2-D IC by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 27: World 16-Year Perspective for 2-D IC by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa for Years 2014, 2023 & 2030

Table 28: World Recent Past, Current & Future Analysis for 3-D
IC by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2022 through 2030 and % CAGR

Table 29: World Historic Review for 3-D IC by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 30: World 16-Year Perspective for 3-D IC by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa for Years 2014, 2023 & 2030

Table 31: World Recent Past, Current & Future Analysis for Flip
Chip by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2022 through 2030 and % CAGR

Table 32: World Historic Review for Flip Chip by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 33: World 16-Year Perspective for Flip Chip by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa for Years 2014, 2023 & 2030

Table 34: World Recent Past, Current & Future Analysis for Wire
Bond & Die Attach by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2022 through 2030 and % CAGR

Table 35: World Historic Review for Wire Bond & Die Attach by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2014 through 2021 and % CAGR

Table 36: World 16-Year Perspective for Wire Bond & Die Attach
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2014, 2023 & 2030

Table 37: World Recent Past, Current & Future Analysis for
FOWLP by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2022 through 2030 and % CAGR

Table 38: World Historic Review for FOWLP by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 39: World 16-Year Perspective for FOWLP by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa for Years 2014, 2023 & 2030

Table 40: World System-in-Package (SiP) Technology Market
Analysis of Annual Sales in US$ Million for Years 2014 through
2030

III. MARKET ANALYSIS

UNITED STATES
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in the United States
for 2023 (E)
Table 41: USA Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 42: USA Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 43: USA 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Technology - Percentage Breakdown of
Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years 2014,
2023 & 2030

Table 44: USA Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 45: USA Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 46: USA 16-Year Perspective for System-in-Package (SiP)
Technology by Application - Percentage Breakdown of Value Sales
for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 47: USA Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 48: USA Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 49: USA 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Method - Percentage Breakdown of Value
Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for the
Years 2014, 2023 & 2030

CANADA
Table 50: Canada Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 51: Canada Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 52: Canada 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Technology - Percentage Breakdown
of Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years
2014, 2023 & 2030

Table 53: Canada Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 54: Canada Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 55: Canada 16-Year Perspective for System-in-Package
(SiP) Technology by Application - Percentage Breakdown of Value
Sales for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 56: Canada Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 57: Canada Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 58: Canada 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Method - Percentage Breakdown of
Value Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for
the Years 2014, 2023 & 2030

JAPAN
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
Table 59: Japan Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 60: Japan Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 61: Japan 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Technology - Percentage Breakdown of
Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years 2014,
2023 & 2030

Table 62: Japan Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 63: Japan Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 64: Japan 16-Year Perspective for System-in-Package (SiP)
Technology by Application - Percentage Breakdown of Value Sales
for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 65: Japan Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 66: Japan Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 67: Japan 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Method - Percentage Breakdown of Value
Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for the
Years 2014, 2023 & 2030

CHINA
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in China for 2023 (E)
Table 68: China Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 69: China Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 70: China 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Technology - Percentage Breakdown of
Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years 2014,
2023 & 2030

Table 71: China Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 72: China Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 73: China 16-Year Perspective for System-in-Package (SiP)
Technology by Application - Percentage Breakdown of Value Sales
for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 74: China Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 75: China Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 76: China 16-Year Perspective for System-in-Package (SiP)
Technology by Packaging Method - Percentage Breakdown of Value
Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for the
Years 2014, 2023 & 2030

EUROPE
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
Table 77: Europe Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Geographic Region -
France, Germany, Italy, UK, Spain, Russia and Rest of Europe
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2022 through 2030 and % CAGR

Table 78: Europe Historic Review for System-in-Package (SiP)
Technology by Geographic Region - France, Germany, Italy, UK,
Spain, Russia and Rest of Europe Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2014 through 2021 and
% CAGR

Table 79: Europe 16-Year Perspective for System-in-Package
(SiP) Technology by Geographic Region - Percentage Breakdown of
Value Sales for France, Germany, Italy, UK, Spain, Russia and
Rest of Europe Markets for Years 2014, 2023 & 2030

Table 80: Europe Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 81: Europe Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 82: Europe 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Technology - Percentage Breakdown
of Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years
2014, 2023 & 2030

Table 83: Europe Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 84: Europe Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 85: Europe 16-Year Perspective for System-in-Package
(SiP) Technology by Application - Percentage Breakdown of Value
Sales for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 86: Europe Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 87: Europe Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 88: Europe 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Method - Percentage Breakdown of
Value Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for
the Years 2014, 2023 & 2030

FRANCE
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in France for 2023 (E)
Table 89: France Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 90: France Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 91: France 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Technology - Percentage Breakdown
of Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years
2014, 2023 & 2030

Table 92: France Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 93: France Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 94: France 16-Year Perspective for System-in-Package
(SiP) Technology by Application - Percentage Breakdown of Value
Sales for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 95: France Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 96: France Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 97: France 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Method - Percentage Breakdown of
Value Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for
the Years 2014, 2023 & 2030

GERMANY
System-in-Package (SiP) Technology Market Presence - Strong/
Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
Table 98: Germany Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 99: Germany Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

Table 100: Germany 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Technology - Percentage Breakdown
of Value Sales for 2.5-D IC, 2-D IC and 3-D IC for the Years
2014, 2023 & 2030

Table 101: Germany Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Application - Consumer
Electronics, Telecommunications, Automotive, Aerospace &
Defense, Industrial and Other Applications - Independent
Analysis of Annual Sales in US$ Million for the Years 2022
through 2030 and % CAGR

Table 102: Germany Historic Review for System-in-Package (SiP)
Technology by Application - Consumer Electronics,
Telecommunications, Automotive, Aerospace & Defense, Industrial
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2014 through 2021 and % CAGR

Table 103: Germany 16-Year Perspective for System-in-Package
(SiP) Technology by Application - Percentage Breakdown of Value
Sales for Consumer Electronics, Telecommunications, Automotive,
Aerospace & Defense, Industrial and Other Applications for the
Years 2014, 2023 & 2030

Table 104: Germany Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Method - Flip
Chip, Wire Bond & Die Attach and FOWLP - Independent Analysis
of Annual Sales in US$ Million for the Years 2022 through 2030
and % CAGR

Table 105: Germany Historic Review for System-in-Package (SiP)
Technology by Packaging Method - Flip Chip, Wire Bond & Die
Attach and FOWLP Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2014 through 2021 and % CAGR

Table 106: Germany 16-Year Perspective for System-in-Package
(SiP) Technology by Packaging Method - Percentage Breakdown of
Value Sales for Flip Chip, Wire Bond & Die Attach and FOWLP for
the Years 2014, 2023 & 2030

ITALY
Table 107: Italy Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Packaging Technology -
2.5-D IC, 2-D IC and 3-D IC - Independent Analysis of Annual
Sales in US$ Million for the Years 2022 through 2030 and % CAGR

Table 108: Italy Historic Review for System-in-Package (SiP)
Technology by Packaging Technology - 2.5-D IC, 2-D IC and 3-D
IC Markets - Independent Analysis of Annual Sales in US$
Million for Years 2014 through 2021 and % CAGR

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