Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
March 26, 2024 11:42 ET
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Efabless Corporation
Efabless unveils its 4th AI Open-Source Silicon Design Challenge, "AI Wake Up Call!", targeting generative AI for Keyword Spotting on Caravel SoC.
Ambiq Apollo510 Delivers 30x Power Efficiency Improvement to Unleash Endpoint AI
March 26, 2024 08:15 ET
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Ambiq
Introducing the next-generation Ambiq Apollo510 MCU that Delivers 30x Power Efficiency Improvement for Endpoint AI
Global Leaded Multi-Layer Ceramic Capacitor Market Set to Reach $14.2 Billion by 2030
March 25, 2024 13:11 ET
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Research and Markets
Dublin, March 25, 2024 (GLOBE NEWSWIRE) -- The "Leaded Multi-Layer Ceramic Capacitor Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ...
Global Semiconductor Plastic Market Set for Significant Growth, Forecasted to Surge at 7.2% CAGR through 2030
March 22, 2024 11:29 ET
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Research and Markets
Dublin, March 22, 2024 (GLOBE NEWSWIRE) -- The "Semiconductor Plastic Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ResearchAndMarkets.com's offering. ...
Global Ultra Wideband Chipset Market Set for Continued Growth to2028
March 22, 2024 06:16 ET
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Research and Markets
Dublin, March 22, 2024 (GLOBE NEWSWIRE) -- The "Global Ultra Wideband Chipset Market (2023-2028) Competitive Analysis, Impact of Covid-19, Ansoff Analysis" report has been added to ...
Global Diodes Market Research 2024-2028: High-Speed Data Transmission Needs Fuel Growth
March 20, 2024 17:08 ET
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Research and Markets
Dublin, March 20, 2024 (GLOBE NEWSWIRE) -- The "Global Diodes Market 2024-2028" report has been added to ResearchAndMarkets.com's offering.The diodes market is forecasted to grow by USD 1.32 bn...
Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
March 19, 2024 08:02 ET
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Deca Technologies
Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
Arctic Semiconductor Unveils SilverWings: The World's Premier Low-Power All-in-One RF Transceiver
March 19, 2024 08:00 ET
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Arctic Semiconductor
SAN JOSE, Calif., March 19, 2024 (GLOBE NEWSWIRE) -- Arctic Semiconductor, a pioneer in low-power, versatile RF, and mixed-signal chipsets, unveiled SilverWings today. Representing a breakthrough in...
ROHM Develops Automotive Primary LDOs: Leveraging Original QuiCur Technology to Achieve Industry-Leading Load Response Characteristics
March 14, 2024 17:00 ET
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ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, March 14, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the new BD9xxM5-C series of 45V rated, 500mA output primary LDO regulators (BD933M5EFJ-C,...
Global Semiconductor Intellectual Property (IP) Market Forecast Report 2024-2029: Expanding Telecommunications & Data Center and Automotive Verticals to Drive Growth of Semiconductor IP Market
March 14, 2024 13:22 ET
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Research and Markets
Dublin, March 14, 2024 (GLOBE NEWSWIRE) -- The "Global Semiconductor Intellectual Property (IP) Market by Design IP (Processor IP, Memory IP, Interface IP), IP Source (Royalty, Licensing), IP Core...