Socios.com Partners With canow Co. Ltd. To Bring Tokenized Fan Engagement To Japanese & Southeast Asian Sports Fans And The Clubs They Love.
December 16, 2020 18:03 ET
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canow Co.,Ltd.
Tokyo, Japan, Dec. 16, 2020 (GLOBE NEWSWIRE) -- canow Co., Ltd. (Chiyoda-ku, Tokyo, CEO: Kunihiro Katsuragi, hereinafter canow) and Socios.com are partnering together to on-board Japanese and...
FXCM Group Reports Monthly Execution Data
May 28, 2020 10:26 ET
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FXCM Group
LONDON and SYDNEY, Australia and JOHANNESBURG, South Africa, May 28, 2020 (GLOBE NEWSWIRE) -- FXCM Group, LLC ("FXCM Group" or “FXCM”), a leading international provider of online foreign exchange...
Global Integrated Passive Devices Industry
January 17, 2020 03:43 ET
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ReportLinker FR
New York, Jan. 17, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Integrated Passive Devices Industry" - https://www.reportlinker.com/p05798923/?utm_source=GNW...
Global OSAT Market Set to Witness a CAGR of 6% During 2019-2024 -- 5G is Expected to Fuel Growth
July 23, 2019 05:30 ET
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Research and Markets
Dublin, July 23, 2019 (GLOBE NEWSWIRE) -- The "Outsourced Semiconductor Assembly and Test (OSAT) Market - Growth, Trends, and Forecast (2019 - 2024)" report has been added to ...
STATS and SportsCastr Partner to Deliver Real-Time Sports Information Through FanChain Integration
December 19, 2018 09:00 ET
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SportsCastr
CHICAGO / NEW YORK CITY, Dec. 19, 2018 (GLOBE NEWSWIRE) -- (via Blockchain Wire) -- SportsCastr, the blockchain-based live-streaming company backed by NBA Commissioner Emeritus David Stern and the...
JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee Choon Heung as CEO
September 27, 2018 23:54 ET
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STATS ChipPAC Pte. Ltd.
JIANGYIN, China, Sept. 27, 2018 (GLOBE NEWSWIRE) -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced...
STATS ChipPAC Expands AEC-Q100 Qualification of eWLB for Automotive Applications
May 01, 2018 18:00 ET
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STATS ChipPAC Pte. Ltd.
UNITED STATES, May 01, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, May 02, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test...
STATS ChipPAC’s Patent Portfolio Recognised for the Eighth Consecutive Year by IEEE
January 15, 2018 17:00 ET
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STATS ChipPAC Pte. Ltd.
UNITED STATES, Jan. 15, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, Jan. 16, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and...
STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
March 15, 2017 00:24 ET
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STATS ChipPAC Pte. Ltd.
SINGAPORE - 15 MARCH 2017, UNITED STATES--(Marketwired - March 15, 2017) - STATS ChipPAC Pte. Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test...
STATS ChipPAC Recognized for Patent Innovations for the Seventh Consecutive Year by IEEE
January 23, 2017 10:45 ET
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STATS ChipPAC
SINGAPORE -- 23 JANUARY 2017, UNITED STATES--(Marketwired - January 23, 2017) - STATS ChipPAC Pte. Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and...