New JCET 12 Inch Wafer Bumping Line in Advanced Flip Chip South Korea Factory Ramps into High Volume INCHEON, South Korea, July 29, 2019 (GLOBE NEWSWIRE) -- Jiangsu Changjiang Electronics Technology Co., Ltd. (‘JCET’) has moved into volume production with its new 12 inch wafer bumping line which is...

JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee Choon Heung as CEO JIANGYIN, China, Sept. 27, 2018 (GLOBE NEWSWIRE) -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced...

STATS ChipPAC Expands AEC-Q100 Qualification of eWLB for Automotive Applications UNITED STATES, May 01, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, May 02, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test...

STATS ChipPAC’s Patent Portfolio Recognised for the Eighth Consecutive Year by IEEE UNITED STATES, Jan. 15, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, Jan. 16, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and...