Latest News and Press Releases

Want to stay updated on the latest news?

Sign into Reader Account Create Reader Account

July 29, 2019 13:27 ET | Source: Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)

New JCET 12 Inch Wafer Bumping Line in Advanced Flip Chip South Korea Factory Ramps into High Volume

INCHEON, South Korea, July 29, 2019 (GLOBE NEWSWIRE) -- Jiangsu Changjiang Electronics Technology Co., Ltd. (‘JCET’) has moved into volume production with its new 12 inch wafer bumping line which is...
September 27, 2018 23:54 ET | Source: STATS ChipPAC Pte. Ltd.

JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee Choon Heung as CEO

JIANGYIN, China, Sept. 27, 2018 (GLOBE NEWSWIRE) -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced...
May 01, 2018 18:00 ET | Source: STATS ChipPAC Pte. Ltd.

STATS ChipPAC Expands AEC-Q100 Qualification of eWLB for Automotive Applications

UNITED STATES, May 01, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, May 02, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test...
January 15, 2018 17:00 ET | Source: STATS ChipPAC Pte. Ltd.

STATS ChipPAC’s Patent Portfolio Recognised for the Eighth Consecutive Year by IEEE

UNITED STATES, Jan. 15, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, Jan. 16, 2018 -- STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and...