Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference
July 10, 2023 11:00 ET
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Xpeedic Technology, Inc.
EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System SimulationContinuous Demonstrations This Week at Design...
Xpeedic Ships Unprecedented Two-Billionth Integrated Passive Device
June 13, 2023 14:27 ET
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Xpeedic Technology, Inc.
Adoption Driven by Need for Smaller, High-Performance, Cost-Effective, Reliable Electronic Systems Xpeedic IPDs, Development Platform Showcased Today Through Thursday at IMS in San Diego SAN DIEGO,...
Xpeedic Releases RF EDA Solution 2023 at IMS
June 13, 2023 14:25 ET
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Xpeedic Technology, Inc.
RF EDA Solution Accelerates Design of RF Modules, Systems Using Chip-Package-System EDA tools and IPD IPDemonstrated Today Through Thursday at IMS in San Diego SAN DIEGO, June 13, 2023 (GLOBE...
Xpeedic Takes 2023 3D InCites Herb Reiter Design Tool Provider of the Year Award
March 14, 2023 11:00 ET
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Xpeedic Technology, Inc.
CUPERTINO, Calif., March 14, 2023 (GLOBE NEWSWIRE) -- Xpeedic today was named the 2023 Herb Reiter Design Tool Provider of the Year Award recipient by 3D InCites for its Metis platform, developed to...
Xpeedic Releases Notus at DesignCon2023, Announces Upgrades to Advanced Packaging and High-Speed Digital Solutions
February 01, 2023 11:01 ET
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Xpeedic Technology, Inc.
CUPERTINO, Calif., Feb. 01, 2023 (GLOBE NEWSWIRE) -- Xpeedic today released Notus, an electronic design automation (EDA) platform for package/board SI/PI/thermal analysis, at DesignCon 2023 at the...
Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products
September 20, 2022 11:00 ET
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Xpeedic Technology, Inc.
CUPERTINO, Calif., Sept. 20, 2022 (GLOBE NEWSWIRE) -- Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic...