eSilicon to present at State of AI and ML – Spring 2019
April 02, 2019 14:50 ET
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eSilicon Corporation
SAN JOSE, Calif., April 02, 2019 (GLOBE NEWSWIRE) -- What:eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, is giving a...
Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
April 02, 2019 08:00 ET
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eSilicon Corporation
SAN JOSE, Calif., April 02, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate its 7nm...
DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia
March 20, 2019 20:35 ET
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eSilicon Corporation
BARCELONA, Spain, March 20, 2019 (GLOBE NEWSWIRE) -- What:eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, with the...
OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
March 12, 2019 18:58 ET
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eSilicon Corporation
SAN JOSE, Calif., March 12, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate its 7nm...
Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC
March 05, 2019 14:31 ET
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eSilicon Corporation
SAN DIEGO, March 05, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today at the OFC conference...
OFC 2019: eSilicon to demonstrate two 7nm IP products: 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
February 27, 2019 08:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Feb. 27, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate two 7nm...
领先的FinFET ASIC供应商eSilicon 的最新势态
February 13, 2019 16:00 ET
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eSilicon Corporation
加利福尼亚州圣何塞, Feb. 14, 2019 (GLOBE NEWSWIRE) -- 作为领先的FinFET ASIC供应商以及提供市场专用IP平台和先进的2.5D封装解决方案的eSilicon，今天宣布其部署了该公司在一级FinFET ASIC市场中的增长以及实现了服务于高带宽网络，高性能计算，AI和5G基础设施的多个里程碑。 ...
eSilicon builds momentum as a strong tier one FinFET ASIC supplier
February 13, 2019 16:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Feb. 13, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement...
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
February 12, 2019 08:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Feb. 12, 2019 (GLOBE NEWSWIRE) -- What:eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, is presenting a...
eSilicon and Wild River Technology Announce Advanced SerDes Test System
January 30, 2019 08:00 ET
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eSilicon Corporation
SANTA CLARA, Calif., Jan. 30, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, in collaboration with Wild...