An OmPP RF package from Quik-Pak
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
October 06, 2020 09:00 ET | Quik-Pak
ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages....
New Quik-Pak building
Quik-Pak Relocates to Larger, Customized Facility
April 07, 2020 09:00 ET | Quik-Pak
ESCONDIDO, Calif., April 07, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all...
Flip-chip QFN
Quik-Pak Announces Substrate Development Service
February 11, 2020 09:00 ET | Quik-Pak
SAN DIEGO, Feb. 11, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly...
QP logo PMG.png
Quik-Pak Acquires Wafer-Preparation Firm QBBS
November 25, 2019 08:00 ET | Quik-Pak
SAN DIEGO, Calif., Nov. 25, 2019 (GLOBE NEWSWIRE) -- Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced it has acquired Santa Clara-based QBBS to...