Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry’s Fastest Performance for Smartphones
June 21, 2023 09:00 ET
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Micron Technology, Inc.
BOISE, Idaho, June 21, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile...
Embedded Non-Volatile Memory Market to Grow at a CAGR of 15.3% from 2021 to 2031, Reaching US$ 218.6 Million: As per TMR Study
April 18, 2023 16:30 ET
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Transparency Market Research
Wilmington, Delaware, United States , April 19, 2023 (GLOBE NEWSWIRE) -- Transparency Market Research Inc. - The global embedded non-volatile memory market stood at US$ 61.1 million in 2022 and the...
Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership
July 26, 2022 09:00 ET
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Micron Technology, Inc.
BOISE, Idaho, July 26, 2022 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume production of the world’s first 232-layer NAND, built with...
Micron Launches World’s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences
July 29, 2021 08:00 ET
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Micron Technology, Inc.
BOISE, Idaho, July 29, 2021 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq: MU) announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS)...
Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM
June 01, 2021 21:10 ET
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Micron Technology, Inc.
TAIPEI, Taiwan, June 01, 2021 (GLOBE NEWSWIRE) -- Computex -- Micron Technology, Inc. (Nasdaq: MU), today unveiled memory and storage innovations across its portfolio based on its industry-leading...
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
January 27, 2021 16:10 ET
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Lam Research Corporation
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND and DRAM roadmaps FREMONT, Calif., Jan. 27, 2021 ...
Greenliant Displays Broad Portfolio of Industrial Grade SSDs and Memory Cards at ICCAD 2020
December 08, 2020 09:00 ET
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Greenliant
SANTA CLARA, Calif. and CHONGQING, China, Dec. 08, 2020 (GLOBE NEWSWIRE) -- Greenliant’s high reliability solid state storage products will be on display at ICCAD 2020 in Chongqing, December 10-11,...
绿芯将在重庆ICCAD-2020上展示其全面的工业级固态硬盘和存储卡产品
December 08, 2020 09:00 ET
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Greenliant
中国，重庆和美国，硅谷, Dec. 08, 2020 (GLOBE NEWSWIRE) -- 绿芯将于12月10日至11日在重庆举行的ICCAD-2020（中关村IC Park展台141-142和153-154展位）上展示其高可靠固态存储产品。其ArmourDrive®，NANDrive®和工业企业级固态硬盘产品组合专注于高耐久性、长数据保持力和长生命周期支持，可满足严苛应用环境的客户需求。 ...
Micron Ships World’s First 176-Layer NAND, Delivering A Breakthrough in Flash Memory Performance and Density
November 09, 2020 16:01 ET
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Micron Technology, Inc.
BOISE, Idaho, Nov. 09, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume shipments of the world’s first 176-layer 3D NAND flash memory,...
Greenliant Sampling Energy-Efficient DRAM-less NVMe M.2 2280 ArmourDrive™ SSDs for High-Performance Data Storage
November 02, 2020 09:00 ET
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Greenliant
SANTA CLARA, Calif., Nov. 02, 2020 (GLOBE NEWSWIRE) -- Greenliant has started sampling its DRAM-less NVMe M.2 2280 ArmourDrive™ solid state drive (SSD) modules to customers requiring data storage...