Rising Trend of Miniaturization to Steer Flip Chip Technology Market Past US$ 47.6 Billion by 2032, Persistence Market Research
April 10, 2023 12:15 ET
|
Persistence Market Research
New York, April 10, 2023 (GLOBE NEWSWIRE) -- The global Flip Chip Technology Market size is set to rise from US$ 31.3 billion in 2022 to US$ 47.6 billion by 2032. Over the next ten years, global...
Growth Opportunities in Tunnel Magneto-Resistant (TMR) Sensors, LiDAR Sensors, CMOS Image Sensors, X Ray Sensors and Biosensors 2022: Featuring Aico, Baumer, Omnitron, Sony Semiconductors & More
March 17, 2023 09:18 ET
|
Research and Markets
Dublin, March 17, 2023 (GLOBE NEWSWIRE) -- The "Growth Opportunities in Tunnel Magneto-Resistant (TMR) Sensors, LiDAR Sensors, CMOS Image Sensors, X Ray Sensors and Biosensors" report has been added...
Global Automotive CMOS Image Sensor (CIS) Chip Market Report 2022: Featuring OnSemi, Samsung Electronics, Sony, Toshiba, Infineon, STMicroelectronics (ST), OmniVision Technologies & More
February 13, 2023 06:39 ET
|
Research and Markets
Dublin, Feb. 13, 2023 (GLOBE NEWSWIRE) -- The "Automotive CMOS Image Sensor (CIS) Chip Industry Research Report, 2022" report has been added to ResearchAndMarkets.com's offering.Automotive CIS...
Teledyne e2v 发布首款适用于任何光照条件、无运动伪影的 ToF 传感器 Hydra3D+
January 10, 2023 02:00 ET
|
Teledyne e2v
法国格勒诺布尔, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v（隶属于 Teledyne Technologies [NYSE: TDY]）发布新款飞行时间（ToF）CMOS 图像传感器 Hydra3D+，像素分辨率为 832 x 600，为多功能 3D 检测和测量量身定制。 Hydra3D+ 采用 Teledyne e2v 专有的 CMOS...
Teledyne e2v, 모션 아티팩트 없이 모든 조명 조건에서 작동하는 최초의 고해상도 ToF 센서인 Hydra3D+ 출시
January 10, 2023 02:00 ET
|
Teledyne e2v
프랑스 그르노블, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne Technologies[NYSE: TDY]에 속한 Teledyne e2v는 832 x 600 픽셀 해상도를 통합하고 다목적 3D 감지 및 측정에 적합한 새로운 ToF CMOS 이미지 센서인 Hydra3D+의 출시를 발표했습니다. Teledyne e2v의...
Teledyne e2vは、モーションアーティファクトなしで、あらゆる光環境で動作可能な初の高解像度ToFセンサーHydra3D+をリリースします。
January 10, 2023 02:00 ET
|
Teledyne e2v
フランス、グルノーブル, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne Technologies[NYSE: TDY]の子会社であるTeledyne e2vは、Hydra3D+のリリースを発表しました。これは、832 x 600ピクセルの解像度を搭載した新しいToF CMOSイメージセンサーで、多用途の3D検出および測定用にカスタマイズされています。 ...
Teledyne e2v 推出 Hydra3D+，首款在所有光線環境下運作都不會產生運動偽影的高解析度 ToF 感測器
January 10, 2023 02:00 ET
|
Teledyne e2v
法國格勒諾布爾, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne Technologies [NYSE: TDY] 旗下公司 Teledyne e2v 宣布推出一款全新的飛行時間 (ToF) CMOS 影像感測器——Hydra3D+。這款感測器具備 832 x 600 像素的解析度，專為多功能 3D 偵測和距離測量量身打造。 Hydra3D+ 採用...
Teledyne e2v stellt mit Hydra3D+ den ersten hochauflösenden ToF-Sensor für alle Lichtverhältnisse ohne Bewegungsartefakte vor
January 10, 2023 02:00 ET
|
Teledyne e2v
GRENOBLE, Frankreich, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, ein Unternehmen von Teledyne Technologies [NYSE: TDY] gibt die Markteinführung von Hydra3D+ bekannt. Dieser neue Time-of-Flight...
Teledyne e2v releases Hydra3D+, the first high resolution ToF sensor to work in all light conditions without motion artefacts
January 10, 2023 02:00 ET
|
Teledyne e2v
GRENOBLE, France, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its Hydra3D+, a new Time-of-Flight (ToF) CMOS image sensor...
The Worldwide Low Light Imaging Industry is Projected to Reach $19.9 Billion by 2027
December 13, 2022 06:33 ET
|
Research and Markets
Dublin, Dec. 13, 2022 (GLOBE NEWSWIRE) -- The "Global Low Light Imaging Market by Technology (CMOS and CCD), Application (Photography, Monitoring, Inspection & Detection, and Security &...