Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production
June 30, 2020 08:30 ET | GLOBALFOUNDRIES
Santa Clara, Calif., June 30, 2020 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced its most advanced FinFET solution, 12LP+, has completed...
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NXP Accelerates Edge Computing Revolution
February 26, 2019 03:00 ET | NXP USA, Inc.
News Highlights NXP announces i.MX 8M Nano – power-optimized, scalable, multi-core heterogeneous applications processors built in advanced 14nm LPC FinFET processPin-compatible with i.MX 8M Mini and...
Sunflower Mission awards 59 university scholarships to Vietnam’s future engineers
December 20, 2018 17:00 ET | eSilicon Corporation; Sunflower Mission
HO CHI MINH CITY, Vietnam, Dec. 20, 2018 (GLOBE NEWSWIRE) -- Sunflower Mission marked its sixteenth year of supporting student education in Vietnam and presented a total of 59 university...
Tổ chức Sunflower Mission trao 59 suất học bổng cho các kỹ sư tương lai của Việt Nam
December 20, 2018 17:00 ET | eSilicon Corporation; Sunflower Mission
Thành phố Hồ Chí Minh, Việt Nam, Dec. 21, 2018 (GLOBE NEWSWIRE) -- Ngày 20 tháng 12, 2018 –  Tổ chức Sunflower Mission đã đánh dấu 16 năm hỗ trợ giáo dục tại Việt Nam và trao tặng 59 suất...
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SemIsrael 2018: eSilicon to present on IP platforms for AI and high-performance networking ASICs
November 20, 2018 00:00 ET | eSilicon Corporation
SAN JOSE, Calif., Nov. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present its two new...
eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
October 25, 2018 08:00 ET | eSilicon Corporation
Demos and private meetings available at SC18 SAN JOSE, Calif., Oct. 25, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D...
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ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018
October 24, 2018 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Oct. 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two...
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Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara
October 01, 2018 08:00 ET | Open-Silicon
MILPITAS, Calif., Oct. 01, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance...
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eSilicon to demonstrate silicon performance of its 7nm 56G long-reach SerDes at ECOC, September 24-26, 2018
September 20, 2018 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Sept. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate the...
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eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
September 18, 2018 05:00 ET | eSilicon Corporation
SAN JOSE, Calif., Sept. 18, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...