STATS ChipPAC Ranked in Top 10 Semiconductor Manufacturing Companies by the IEEE for Its Patent Innovations
January 07, 2013 16:00 ET
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STATS ChipPAC
SINGAPORE -- 8 JANUARY 2013, UNITED STATES--(Marketwire - Jan 7, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading provider of advanced semiconductor...
STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic
December 05, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 6 DECEMBER 2012, UNITED STATES--(Marketwire - Dec 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
November 05, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Advances Through Silicon Via Capabilities With the Qualification of 300mm Mid-End Processing and Low Volume Manufacturing
August 27, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire - Aug 27, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Announces Volume Manufacturing of fcCuBE(TM) Technology and Expanded Processing Capability for This Advanced Flip Chip Packaging Solution
July 08, 2012 19:30 ET
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STATS ChipPAC
SINGAPORE--09/07/2012, UNITED STATES--(Marketwire - Jul 8, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
April 11, 2012 11:55 ET
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STATS ChipPAC
SINGAPORE--11/04/2012, UNITED STATES--(Marketwire - Apr 11, 2012) - STATS ChipPAC Ltd. has been recognized as one of 19 companies receiving Intel Corporation's Preferred Quality Supplier (PQS)...
STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology
March 06, 2012 08:30 ET
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STATS ChipPAC
SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications
October 05, 2011 09:30 ET
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STATS ChipPAC
SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
April 19, 2011 12:45 ET
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STATS ChipPAC
SINGAPORE -- 4/20/2011, UNITED STATES--(Marketwire - Apr 19, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) has been recognised to receive Intel Corporation's Preferred Quality...
STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing
April 18, 2011 16:00 ET
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STATS ChipPAC
SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...