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SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
October 30, 2019 07:00 ET | Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...
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Kandou Secures $56 Million in Series C Funding
September 23, 2019 07:00 ET | Kandou Bus
LAUSANNE, Switzerland, Sept. 23, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in connectivity IP and chip solutions, today announced an additional investment of $56 million, through a consortium...
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Kandou Announces 100th Patent Grant by U.S. Patent Office
December 11, 2018 07:00 ET | Kandou Bus
LAUSANNE, Switzerland, Dec. 11, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has...
Kandou Announces Availability of Glasswing™ USR SerDes IP
May 23, 2018 07:00 ET | Kandou Bus
LAUSANNE, Switzerland, May 23, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the Glasswing™ USR SerDes, enabling...