ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics เปิดตัว Industrial 176-Layer PCIe® Gen 4 x4 M.2, U.2 SSD ที่นำเสนอประสิทธิภาพ R/W ที่ยอดเยี่ยมพร้อมความจุสูงสุด 7.68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics ผู้นำระดับโลกด้านโซลูชั่นการจัดเก็บข้อมูลและหน่วยความจำเฉพาะทาง เปิดตัวอุปกรณ์จัดเก็บข้อมูล N600 Series M.2 2280 และ U.2 solid...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics Lança SSDs 176-Layer PCIe® Gen 4 x4 M.2, U.2 Industriais que Oferecem Excelente Desempenho R/W, Capacidade Máxima de 7,68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- A ATP Electronics, líder global em soluções especializadas de armazenamento e memória, apresenta os seus mais recentes drives de estado sólido...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics의 산업용 176레이어 PCIe® 4세대 x4 M.2와 U.2 SSD, 탁월한 R/W 성능과 최대 용량 7.68 TB 제공
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
대만 타이페이, June 28, 2023 (GLOBE NEWSWIRE) -- 특수 저장 및 메모리 솔루션 분야의 글로벌 선도 기업인 ATP Electronics가 4세대 PCIe® 인터페이스와 NVMe™ 프로토콜을 지원하는 최신 고속 N600 Series M.2 2280와 U.2 솔리드 스테이트 드라이브(SSDs)를 선보인다. 새로워진 ATP...
Global DRAM Module and Components Market
DRAM Module and Component Market by Type, End-user Industries, Memory and Geography - Global Forecast to 2027
May 09, 2022 07:03 ET | Research and Markets
Dublin, May 09, 2022 (GLOBE NEWSWIRE) -- The "DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer...
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
March 18, 2022 11:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 18, 2022 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest line of M.2 2280 NVMe solid state drives...
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Flash and XPoint Memory Applications and Market Forecasts to 2026 - End-use Markets, Shipments, Market Shares by Vendor, and More
September 30, 2021 05:23 ET | Research and Markets
Dublin, Sept. 30, 2021 (GLOBE NEWSWIRE) -- The "Flash and XPoint Memory Applications and Markets: 2019-2026" report has been added to ResearchAndMarkets.com's offering. Flash and XPoint memory...
ATP Electronics Thermal Management Memory Solution
ATP最大3.48/8TBのストレージを備えたNVMe M.2/U.2 SSD用の銅箔、フィンタイプ・ヒートシンク/サーマルパッドを発表
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台湾・台北, March 29, 2021 (GLOBE NEWSWIRE) -- 台湾・台北(2021年3月) – 特殊ストレージとメモリ・ソリューションの世界的リーダーであるATP Electronicsは、カスタマイズ可能な熱管理機能を備えた新しいNVMe Flashストレージ・ソリューションの発売を発表しました。...
ATP Electronics Thermal Management Memory Solution
ATP 推出铜箔、鳍型散热/导热片,用于 NVMe M.2/U.2 SSD,存储容量高达 3.84/8 TB
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台北,台湾, March 29, 2021 (GLOBE NEWSWIRE) -- ATP电子,全球领先的专业存储和内存解决方案,宣布推出新的NVMe闪存及可定制的热管理解决方案。热管理解决方案同时使用硬件和固件组件,可防止过热,同时确保最佳的持续性能,尤其是对于 NVMe 固态硬盘 (SSD) 和模块,这些模块在安装在气流很少或根本没有气流的紧凑型系统中时,以飞快的速度运行。 ...
ATP Electronics Thermal Management Memory Solution
ATP présente le dissipateur thermique/tampon thermique à ailettes et feuille de cuivre pour les cartes SSD NVMe M.2/U.2 offrant jusqu'à 3,84/8 To de stockage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 29 mars 2021 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions spécialisées de stockage et de mémoire, a annoncé le lancement de ses nouvelles solutions de...
ATP Electronics Thermal Management Memory Solution
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with...