ASCAP Distributes More Than $1.8 Million in ASCAP Plus Cash Awards
March 25, 2013 10:00 ET
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ASCAP
NEW YORK, NY--(Marketwire - Mar 25, 2013) - The American Society of Composers, Authors and Publishers (ASCAP) is pleased to announce that more than $1.8 million in cash awards for 2012-2013 was...
ASCAP to Honor Aerosmith's Steven Tyler & Joe Perry With Founders Award at 30th Annual Pop Music Awards
February 19, 2013 10:00 ET
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ASCAP
NEW YORK, NY--(Marketwire - Feb 19, 2013) - The American Society of Composers, Authors and Publishers (ASCAP) will honor Steven Tyler & Joe Perry of Aerosmith with the prestigious ASCAP...
Spreadtrum Adopts STATS ChipPAC's Innovative Packaging for China's Smartphone Market
January 23, 2013 04:30 ET
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STATS ChipPAC
SINGAPORE 23 JANUARY 2013, UNITED STATES--(Marketwire - Jan 23, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) (SGX: S24) today announced implementation of breakthrough performance...
STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic
December 05, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 6 DECEMBER 2012, UNITED STATES--(Marketwire - Dec 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
November 05, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Advances Through Silicon Via Capabilities With the Qualification of 300mm Mid-End Processing and Low Volume Manufacturing
August 27, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire - Aug 27, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
April 11, 2012 11:55 ET
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STATS ChipPAC
SINGAPORE--11/04/2012, UNITED STATES--(Marketwire - Apr 11, 2012) - STATS ChipPAC Ltd. has been recognized as one of 19 companies receiving Intel Corporation's Preferred Quality Supplier (PQS)...
STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology
March 06, 2012 08:30 ET
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STATS ChipPAC
SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications
October 05, 2011 09:30 ET
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STATS ChipPAC
SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
Pacnet Boosts Japan Network Capabilities
July 12, 2011 23:23 ET
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Pacnet
TOKYO--(Marketwire - Jul 12, 2011) - Pacnet, Asia's leading independent telecommunications service provider today announced that it has increased the capacity between its Osaka Point of Presence...