SANTA BARBARA, Calif., July 25, 2007 (PRIME NEWSWIRE) -- Superconductor Technologies Inc. (Nasdaq:SCON) ("STI"), a leading provider of high performance infrastructure products for wireless voice and data applications, today announced Dr. Robert B. Hammond, chief technical officer and senior vice president, is scheduled to present at the International Wireless Industry Consortium (IWPC) Technology Exchange Forum to be held at the Hyatt Regency Woodfield in Schaumburg, IL on August 1-3, 2007.
The forum, titled "High Data Rate Mobile Network Overlays & Base Station Upgrades," is being hosted by Huawei, with participation by Verizon Wireless, US Cellular, T-Mobile. The forum's goal is to identify the most cost-effective techniques for implementing high data rate overlay systems that coexist with previously installed 2G systems. This includes minimizing capital expenditures for the operator upon installation of an overlay or upgrade system and reducing operating expenses in ongoing operation. A second major goal of the forum is to ensure overlay systems and upgrades are "future proofed" to handle fourth-generation standards in the future.
Dr. Hammond's presentation on August 2nd is included in the "RF Subsystem Technologies" section of the program and is titled "Multi-Band Solutions for Evolving Spectrum."
About IWPC
The IWPC is a pro-active international community of wireless and RF product OEMs and their suppliers. Its mission is to facilitate communication up and down the entire supply chain to: identify and clarify markets, products/service opportunities; reduce costs; improve performance; and decrease time to market for all things wireless. More information can be found at http://www.iwpc.org.
About Superconductor Technologies Inc. (STI)
STI, headquartered in Santa Barbara, CA, is a leading provider of high performance infrastructure products for wireless voice and data applications. STI's SuperLink(r) solution increases capacity utilization, lowers dropped and blocked calls, extends coverage, and enables faster wireless data rates. Its AmpLink(tm) solution enhances the performance of wireless base stations by improving receiver sensitivity and geographic coverage.
For information about STI, please visit http://www.suptech.com.
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