Contact Information: Investor Relations Contact: Tham Kah Locke Vice President of Corporate Finance Tel: (65) 6824 7788 Fax: (65) 6720 7826 email: Media Contact: Lisa Lavin Deputy Director of Corporate Communications Tel: (208) 939 3104 Fax: (208) 939 4817 email:
STATS ChipPAC Introduces Pre-Stacked PoP Solution
Fully Integrated PoP Includes 3D Package Assembly, Test and Reflow Process to Provide Customers With a Single High Performance, High Capacity Solution
| Source: STATS ChipPAC
SINGAPORE -- 9/16/2008, UNITED STATES--(Marketwire - September 15, 2008) - STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES : S24 ), a leading
semiconductor test and advanced packaging service provider, today
introduced a new Pre-Stacked Package-on-Package (PoP) solution that
includes both a top and bottom PoP package that are assembled and tested
separately, then stacked and reflowed together to produce a complete high
performance three dimensional (3D) solution.
The rapid adoption and growth of PoP, particularly in the mobile phone
market, has led to a number of new top and bottom PoP packages being
introduced. In a standard PoP process flow, the top and bottom PoP packages
are separately assembled, tested and shipped to a surface mount technology
(SMT) provider for final integration. When top and bottom PoP packages are
stacked and reflowed together during the surface mount process, high reflow
temperatures can cause warpage in both the top and bottom PoP packages,
resulting in yield loss.
STATS ChipPAC has developed a Pre-Stacked PoP solution which consists of a
fully assembled and tested top PoP mounted on top of a fully assembled and
tested bottom PoP package. The top and bottom PoP are reflowed together at
the packaging level to provide customers a fully integrated, fully tested
solution with tightly controlled warpage that achieves higher board mount
yields as compared to conventional PoP packages.
"Pre-Stacked PoP provides our customers with a new approach to integrating
multiple die and diverse technologies in a reduced footprint. The
Pre-Stacked PoP assembly process is unique in that we added a reflow step
to our full turnkey manufacturing flow to provide semiconductor companies
with a pre-stacked, pre-tested solution that can be delivered directly to
their end customers. Pre-Stacked PoP can be easily placed onto a printed
circuit board through the same surface mount process as standard
components," said Dr. Han Byung Joon, Executive Vice President and Chief
Technology Officer, STATS ChipPAC.
Dr. Han continued, "Pre-Stacked PoP is a great solution for applications
such as Solid State Drive and mobile internet devices where customers are
looking for a cost effective way to increase memory density, increase
yields and achieve higher performance levels in a small form factor. Our
innovative Pre-Stacked PoP design has the flexibility to accommodate the
special die size and interconnection requirements for these applications."
In a typical Solid State Drive, logic and memory devices are sourced
separately and placed side-by-side on the application board. With the
versatile design of Pre-Stacked PoP, complex logic and memory devices are
assembled, tested, stacked and reflowed together to achieve a single high
performance, high capacity solution in a small footprint.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, general business and economic conditions and the state of the
semiconductor industry; level of competition; demand for end-use
applications products such as communications equipment and personal
computers; decisions by customers to discontinue outsourcing of test and
packaging services; our reliance on a small group of principal customers;
our continued success in technological innovations; pricing pressures,
including declines in average selling prices; availability of financing;
prevailing market conditions; our ability to meet the applicable
requirements for the termination of registration under the Exchange Act;
our ability to meet specific conditions imposed for the continued listing
or delisting of our ordinary shares on the Singapore Exchange Securities
Trading Limited (SGX-ST); our substantial level of indebtedness; potential
impairment charges; delays in acquiring or installing new equipment;
adverse tax and other financial consequences if the South Korean taxing
authorities do not agree with our interpretation of the applicable tax
laws; our ability to develop and protect our intellectual property;
rescheduling or canceling of customer orders; changes in our product mix;
intellectual property rights disputes and litigation; our capacity
utilization; limitations imposed by our financing arrangements which may
limit our ability to maintain and grow our business; changes in customer
order patterns; shortages in supply of key components; disruption of our
operations; loss of key management or other personnel; defects or
malfunctions in our testing equipment or packages; changes in environmental
laws and regulations; exchange rate fluctuations; regulatory approvals for
further investments in our subsidiaries; majority ownership by Temasek
Holdings (Private) Limited (Temasek) that may result in conflicting
interests with Temasek and our affiliates; unsuccessful acquisitions and
investments in other companies and businesses; labor union problems in
South Korea; uncertainties of conducting business in China and other
countries in Asia; natural calamities and disasters, including outbreaks of
epidemics and communicable diseases; and other risks described from time to
time in the Company's SEC filings, including its annual report on Form 20-F
dated March 7, 2008. You should not unduly rely on such statements. We do
not intend, and do not assume any obligation, to update any forward-looking
statements to reflect subsequent events or circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the SGX-ST. Further information is
available at www.statschippac.com. Information contained in this website
does not constitute a part of this release.