ALTATECH EXPANDS PRODUCT LINE WITH NEW HIGH-SPEED INSPECTION SYSTEM DEDICATED TO ULTRA-THIN SUBSTRATES FOR 3D APPLICATIONS
Eclipse TS Qualified for Volume Manufacturing
at Leading-Edge Semiconductor Manufacturer
Montbonnot, France, October 5, 2015 - Altatech, a specialty equipment manufacturer for mature and advanced materials deposition and defect inspection, announced today the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS and mobile technologies. The Eclipse TS represents a unique high-reliability and easy-to-implement inspection system solution ready for mass production, in response to the demand for these advanced substrates being driven by the rapidly growing markets in automotive, industrial power and mobile electronics. The Eclipse TS has been qualified for volume manufacturing at a leading-edge semiconductor manufacturer.
"We have built a tool based on a strong IP portfolio with a unique capability to inspect the front side, back side and edge of very thin wafers. This is a cost-effective solution with very good throughput. It places Altatech in a leading position within a very large market opportunity," said Jean-Luc Delcarri, general manager of Soitec's Altatech Division.
The Eclipse TS is a high-speed inspection system for measuring very thin and stacked wafers down to 50 microns, Taiko rings, stacked substrates and silicon-on-glass wafers. The system can conduct front-side, back-side and edge inspection in one pass with no back-side contact and accommodate very high bow and wrap wafers up to 6 mm. In today's 3D technologies, substrates undergo grinding, stacking and gluing. The Eclipse system is able to monitor these processes. Inspection occurs without any contact on the active surface with a throughout of more than 90 wafers per hour for 300-mm substrates.
Compliant with the latest automation standards, the Eclipse TS offers comprehensive reporting for defects classification and yield maps.
The full Altatech Eclipse series of advanced metrology and holistic inspection systems ensure wafer-surface and edge quality by detecting, counting and binning defects during the wafer manufacturing process as well as performing continuous outgoing wafer-quality inspection. Proprietary Eclipse sub-modules are designed to detect particles and defects of interest on the front surface and wafer edge of patterned or unpatterned wafers.
Visitors at Semicon Europa 2015 in Dresden, Germany, can stop by Altatech's booth #2038 to learn about the company's unique portfolio of equipment for mature and advanced materials deposition and defect inspection.
About Altatech's Technology and Equipment Expertise:
The Altatech Division offers a unique portfolio of equipment for mature and advanced materials deposition and holistic defect inspection. It develops highly efficient, cost-effective inspection and chemical vapor deposition (CVD) technologies used for R&D and manufacturing of semiconductors, LEDs, MEMS and photovoltaic devices. Altatech Semiconductor S.A. became a subsidiary of Soitec in January 2012.
About Soitec: Soitec (Euronext, Tech 40 Paris) is a world leader in designing and manufacturing high-performance semiconductor materials. The company uses its unique technologies and semiconductor expertise to serve the electronics and energy markets. With 3,600 patents worldwide, Soitec's strategy is based on disruptive innovation to answer its customers' needs for high performance, energy efficiency and cost competitiveness. Soitec has manufacturing facilities, R&D centers and offices in Europe, the U.S. and Asia. For more information, please visit www.soitec.com and follow us on Twitter: @Soitec_EN
| International Media Contact Camille Dufour +33 (0)6 79 49 51 43 camille.dufour@soitec.com | |
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