Dublin, Jan. 31, 2022 (GLOBE NEWSWIRE) -- The "Advanced IC Packaging Market Research Report by Type, by Application, by Region - Global Forecast to 2027 - Cumulative Impact of COVID-19" report has been added to ResearchAndMarkets.com's offering.
The Global Advanced IC Packaging Market size was estimated at USD 35.11 billion in 2020, is expected to reach USD 37.87 billion in 2021, and is projected to grow at a CAGR of 8.22% to reach USD 61.06 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across five major currencies - USD, EUR GBP, JPY, and AUD. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2019 are considered historical years, 2020 as the base year, 2021 as the estimated year, and years from 2022 to 2027 are considered the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Advanced IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
- Based on Type, the market was studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
- Based on Application, the market was studied across Aerospace and Defense, Automotive and Transportation, IT and Telecom, and Mobile and Consumer.
- Based on Region, the market was studied across the Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, and Thailand. Europe, Middle East & Africa is further studied across France, Germany, Italy, Netherlands, Qatar, Russia, Saudi Arabia, South Africa, Spain, United Arab Emirates, and United Kingdom.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Advanced IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Advanced IC Packaging Market, including 3D Plus, Inc., Advanced Semiconductor Engineering Inc., Amkor Technology, Inc., Analog Devices, Inc., Carsem, Inc., CONNECTEC Japan Corporation, Intel Corporation, International Business Machines Corporation, Microchip Technology Inc., Qualcomm Technologies, Inc., Renesas Electronics, Samsung Electronics Co., Ltd, Taiwan Semiconductor Manufacturing Company, Limited, Texas Instruments, and Toshiba Corporation.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Advanced IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Advanced IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Advanced IC Packaging Market?
4. What is the competitive strategic window for opportunities in the Global Advanced IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global Advanced IC Packaging Market?
6. What is the market share of the leading vendors in the Global Advanced IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global Advanced IC Packaging Market?
Key Topics Covered:
1. Preface
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing availability of wide range of consumer electronic devices
5.1.1.2. Developing IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages
5.1.1.3. Growing demand for consumer wearable devices, home appliances, and smartphones
5.1.2. Restraints
5.1.2.1. Lack of technological experts
5.1.3. Opportunities
5.1.3.1. Evolving consumer preferences and choices in terms of latest gadgets and technology coupled with constant innovation in the field of consumer electronics
5.1.3.2. Introduction of packaging technologies supporting IoT driven IC industry
5.1.4. Challenges
5.1.4.1. Big data requirement
5.2. Cumulative Impact of COVID-19
6. Advanced IC Packaging Market, by Type
6.1. Introduction
6.2. 2.5D Integrated Circuit
6.3. 2D Integrated Circuit
6.4. 3D Integrated Circuit
6.5. Fan Out Silicon In Package
6.6. Fan Out Wafer Level Package
6.7. Flip Chip
6.8. Wafer Level Chip Scale Package
7. Advanced IC Packaging Market, by Application
7.1. Introduction
7.2. Aerospace and Defense
7.3. Automotive and Transportation
7.4. IT and Telecom
7.5. Mobile and Consumer
8. Americas Advanced IC Packaging Market
8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States
9. Asia-Pacific Advanced IC Packaging Market
9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
10. Europe, Middle East & Africa Advanced IC Packaging Market
10.1. Introduction
10.2. France
10.3. Germany
10.4. Italy
10.5. Netherlands
10.6. Qatar
10.7. Russia
10.8. Saudi Arabia
10.9. South Africa
10.10. Spain
10.11. United Arab Emirates
10.12. United Kingdom
11. Competitive Landscape
11.1. FPNV Positioning Matrix
11.1.1. Quadrants
11.1.2. Business Strategy
11.1.3. Product Satisfaction
11.2. Market Ranking Analysis
11.3. Market Share Analysis, By Key Player
11.4. Competitive Scenario
11.4.1. Merger & Acquisition
11.4.2. Agreement, Collaboration, & Partnership
11.4.3. New Product Launch & Enhancement
11.4.4. Investment & Funding
11.4.5. Award, Recognition, & Expansion
12. Company Usability Profiles
12.1. 3D Plus, Inc.
12.2. Advanced Semiconductor Engineering Inc.
12.3. Amkor Technology, Inc.
12.4. Analog Devices, Inc.
12.5. Carsem, Inc.
12.6. CONNECTEC Japan Corporation
12.7. Intel Corporation
12.8. International Business Machines Corporation
12.9. Microchip Technology Inc.
12.10. Qualcomm Technologies, Inc.
12.11. Renesas Electronics
12.12. Samsung Electronics Co., Ltd
12.13. Taiwan Semiconductor Manufacturing Company, Limited
12.14. Texas Instruments
12.15. Toshiba Corporation
13. Appendix
For more information about this report visit https://www.researchandmarkets.com/r/fjnaqt
