New York, July 03, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global 3D IC and 2.5D IC Packaging Industry" - https://www.reportlinker.com/p06030518/?utm_source=GNW
3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 8.7% CAGR and reach US$2.8 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 3D TSV segment is readjusted to a revised 9.4% CAGR for the next 8-year period.
The U.S. Market is Estimated at $955 Million, While China is Forecast to Grow at 8.2% CAGR
The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$955 Million in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.1 Billion by the year 2030 trailing a CAGR of 8.2% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 7.8% and 7.2% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.7% CAGR.
Select Competitors (Total 13 Featured)
- Amkor Technology: ASE Group
- Broadcom Ltd.
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Samsung Electronics Co., Ltd.
- Stmicroelectronics Nv
- Taiwan Semiconductor Manufacturing Company Limited
- Toshiba Corp.
- United Microelectronics Corp.
Read the full report: https://www.reportlinker.com/p06030518/?utm_source=GNW
I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Impact of Covid-19 and a Looming Global Recession
Influencer Market Insights
World Market Trajectories
3D IC and 2.5D IC Packaging - Global Key Competitors Percentage
Market Share in 2022 (E)
3D IC and 2.5D IC Packaging Competitor Market Share Scenario
Worldwide (in %): 2018E
Competitive Market Presence - Strong/Active/Niche/Trivial for
Players Worldwide in 2022 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
Table 1: World 3D IC and 2.5D IC Packaging Market Analysis of
Annual Sales in US$ Million for Years 2014 through 2030
Table 2: World Recent Past, Current & Future Analysis for 3D IC
and 2.5D IC Packaging by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 3: World Historic Review for 3D IC and 2.5D IC Packaging
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 4: World 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Geographic Region - Percentage Breakdown of Value
Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World Markets for Years 2014, 2023 & 2030
Table 5: World Recent Past, Current & Future Analysis for 3D
Wafer-level Chip-Scale Packaging by Geographic Region - USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2022 through 2030 and % CAGR
Table 6: World Historic Review for 3D Wafer-level Chip-Scale
Packaging by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2014
through 2021 and % CAGR
Table 7: World 16-Year Perspective for 3D Wafer-level
Chip-Scale Packaging by Geographic Region - Percentage
Breakdown of Value Revenues for USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World for Years 2014, 2023 &
2030
Table 8: World Recent Past, Current & Future Analysis for 3D
TSV by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2022 through 2030
and % CAGR
Table 9: World Historic Review for 3D TSV by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Million for Years 2014 through 2021 and % CAG
Table 11: World Recent Past, Current & Future Analysis for 2.5D
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2022 through 2030
and % CAGR
Table 12: World Historic Review for 2.5D by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 13: World 16-Year Perspective for 2.5D by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2014, 2023 & 2030
Table 14: World Recent Past, Current & Future Analysis for
Logic by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2022 through 2030
and % CAGR
Table 15: World Historic Review for Logic by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 16: World 16-Year Perspective for Logic by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2014, 2023 & 2030
Table 17: World Recent Past, Current & Future Analysis for
Imaging & Optoelectronics by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 18: World Historic Review for Imaging & Optoelectronics
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 19: World 16-Year Perspective for Imaging &
Optoelectronics by Geographic Region - Percentage Breakdown of
Value Revenues for USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
Table 20: World Recent Past, Current & Future Analysis for
Memory by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2022
through 2030 and % CAGR
Table 21: World Historic Review for Memory by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 22: World 16-Year Perspective for Memory by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2014, 2023 & 2030
Table 23: World Recent Past, Current & Future Analysis for MEMS/
Sensors by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2022
through 2030 and % CAGR
Table 24: World Historic Review for MEMS / Sensors by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 25: World 16-Year Perspective for MEMS / Sensors by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 26: World Recent Past, Current & Future Analysis for LED
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2022 through 2030
and % CAGR
Table 27: World Historic Review for LED by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 28: World 16-Year Perspective for LED by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2014, 2023 & 2030
Table 29: World Recent Past, Current & Future Analysis for
Other Applications by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 30: World Historic Review for Other Applications by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 31: World 16-Year Perspective for Other Applications by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 32: World Recent Past, Current & Future Analysis for
Consumer Electronics by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 33: World Historic Review for Consumer Electronics by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 34: World 16-Year Perspective for Consumer Electronics by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 35: World Recent Past, Current & Future Analysis for
Telecommunication by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 36: World Historic Review for Telecommunication by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 37: World 16-Year Perspective for Telecommunication by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 38: World Recent Past, Current & Future Analysis for
Industrial by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2022
through 2030 and % CAGR
Table 39: World Historic Review for Industrial by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Revenues
in US$ Million for Years 2014 through 2021 and % CAGR
Table 40: World 16-Year Perspective for Industrial by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 41: World Recent Past, Current & Future Analysis for
Automotive by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2022
through 2030 and % CAGR
Table 42: World Historic Review for Automotive by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Revenues
in US$ Million for Years 2014 through 2021 and % CAGR
Table 43: World 16-Year Perspective for Automotive by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 44: World Recent Past, Current & Future Analysis for
Smart Technologies by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 45: World Historic Review for Smart Technologies by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 46: World 16-Year Perspective for Smart Technologies by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
Table 47: World Recent Past, Current & Future Analysis for
Other End-Uses by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2022 through 2030 and % CAGR
Table 48: World Historic Review for Other End-Uses by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2014 through 2021
and % CAGR
Table 49: World 16-Year Perspective for Other End-Uses by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2014, 2023 & 2030
III. MARKET ANALYSIS
UNITED STATES
Market Facts & Figures
US 3D IC and 2.5D IC Packaging Market Share (in %) by Company:
2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology)
Market Share Analysis (in %) of Leading Players in the US for
2018 & 2027
3D TSV (Packaging Technology) Competitor Revenue Share (in %)
in the US: 2018 & 2027
2.5D (Packaging Technology) Market Share Breakdown (in %) of
Major Players in the US: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in the United States for 2023
(E)
Market Analytics
Table 50: USA Recent Past, Current & Future Analysis for 3D IC
and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level
Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of
Annual Revenues in US$ Million for the Years 2022 through 2030
and % CAGR
Table 51: USA Historic Review for 3D IC and 2.5D IC Packaging
by Packaging Technology - 3D Wafer-level Chip-Scale Packaging,
3D TSV and 2.5D Markets - Independent Analysis of Annual
Revenues in US$ Million for Years 2014 through 2021 and % CAGR
Table 52: USA 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 53: USA Recent Past, Current & Future Analysis for 3D IC
and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 54: USA Historic Review for 3D IC and 2.5D IC Packaging
by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/
Sensors, LED and Other Applications Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2014
through 2021 and % CAGR
Table 55: USA 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 56: USA Recent Past, Current & Future Analysis for 3D IC
and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 57: USA Historic Review for 3D IC and 2.5D IC Packaging
by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 58: USA 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
CANADA
Table 59: Canada Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 60: Canada Historic Review for 3D IC and 2.5D IC
Packaging by Packaging Technology - 3D Wafer-level Chip-Scale
Packaging, 3D TSV and 2.5D Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2014 through 2021 and
% CAGR
Table 61: Canada 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 62: Canada Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 63: Canada Historic Review for 3D IC and 2.5D IC
Packaging by Application - Logic, Imaging & Optoelectronics,
Memory, MEMS / Sensors, LED and Other Applications Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2014 through 2021 and % CAGR
Table 64: Canada 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 65: Canada Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 66: Canada Historic Review for 3D IC and 2.5D IC
Packaging by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 67: Canada 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
JAPAN
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in Japan for 2023 (E)
Table 68: Japan Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 69: Japan Historic Review for 3D IC and 2.5D IC Packaging
by Packaging Technology - 3D Wafer-level Chip-Scale Packaging,
3D TSV and 2.5D Markets - Independent Analysis of Annual
Revenues in US$ Million for Years 2014 through 2021 and % CAGR
Table 70: Japan 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 71: Japan Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 72: Japan Historic Review for 3D IC and 2.5D IC Packaging
by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/
Sensors, LED and Other Applications Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2014
through 2021 and % CAGR
Table 73: Japan 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 74: Japan Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 75: Japan Historic Review for 3D IC and 2.5D IC Packaging
by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 76: Japan 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
CHINA
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in China for 2023 (E)
Table 77: China Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 78: China Historic Review for 3D IC and 2.5D IC Packaging
by Packaging Technology - 3D Wafer-level Chip-Scale Packaging,
3D TSV and 2.5D Markets - Independent Analysis of Annual
Revenues in US$ Million for Years 2014 through 2021 and % CAGR
Table 79: China 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 80: China Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 81: China Historic Review for 3D IC and 2.5D IC Packaging
by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/
Sensors, LED and Other Applications Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2014
through 2021 and % CAGR
Table 82: China 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 83: China Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 84: China Historic Review for 3D IC and 2.5D IC Packaging
by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 85: China 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
EUROPE
Market Facts & Figures
European 3D IC and 2.5D IC Packaging Market: Competitor Market
Share Scenario (in %) for 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology)
Market Share (in %) by Company in Europe: 2018 & 2027
3D TSV (Packaging Technology) Market Share (in %) of Major
Players in Europe: 2018 & 2027
2.5D (Packaging Technology) Competitor Market Share Analysis
(in %) in Europe: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in Europe for 2023 (E)
Market Analytics
Table 86: Europe Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Geographic Region - France,
Germany, Italy, UK and Rest of Europe Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2022
through 2030 and % CAGR
Table 87: Europe Historic Review for 3D IC and 2.5D IC
Packaging by Geographic Region - France, Germany, Italy, UK and
Rest of Europe Markets - Independent Analysis of Annual
Revenues in US$ Million for Years 2014 through 2021 and % CAGR
Table 88: Europe 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Geographic Region - Percentage Breakdown of Value
Revenues for France, Germany, Italy, UK and Rest of Europe
Markets for Years 2014, 2023 & 2030
Table 89: Europe Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 90: Europe Historic Review for 3D IC and 2.5D IC
Packaging by Packaging Technology - 3D Wafer-level Chip-Scale
Packaging, 3D TSV and 2.5D Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2014 through 2021 and
% CAGR
Table 91: Europe 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 92: Europe Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 93: Europe Historic Review for 3D IC and 2.5D IC
Packaging by Application - Logic, Imaging & Optoelectronics,
Memory, MEMS / Sensors, LED and Other Applications Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2014 through 2021 and % CAGR
Table 94: Europe 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 95: Europe Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 96: Europe Historic Review for 3D IC and 2.5D IC
Packaging by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 97: Europe 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
FRANCE
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in France for 2023 (E)
Table 98: France Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 99: France Historic Review for 3D IC and 2.5D IC
Packaging by Packaging Technology - 3D Wafer-level Chip-Scale
Packaging, 3D TSV and 2.5D Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2014 through 2021 and
% CAGR
Table 100: France 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 101: France Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 102: France Historic Review for 3D IC and 2.5D IC
Packaging by Application - Logic, Imaging & Optoelectronics,
Memory, MEMS / Sensors, LED and Other Applications Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2014 through 2021 and % CAGR
Table 103: France 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 104: France Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 105: France Historic Review for 3D IC and 2.5D IC
Packaging by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 106: France 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
GERMANY
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/
Niche/Trivial - Key Competitors in Germany for 2023 (E)
Table 107: Germany Recent Past, Current & Future Analysis for
3D IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
Table 108: Germany Historic Review for 3D IC and 2.5D IC
Packaging by Packaging Technology - 3D Wafer-level Chip-Scale
Packaging, 3D TSV and 2.5D Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2014 through 2021 and
% CAGR
Table 109: Germany 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Packaging Technology - Percentage Breakdown of
Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV
and 2.5D for the Years 2014, 2023 & 2030
Table 110: Germany Recent Past, Current & Future Analysis for
3D IC and 2.5D IC Packaging by Application - Logic, Imaging &
Optoelectronics, Memory, MEMS / Sensors, LED and Other
Applications - Independent Analysis of Annual Revenues in US$
Million for the Years 2022 through 2030 and % CAGR
Table 111: Germany Historic Review for 3D IC and 2.5D IC
Packaging by Application - Logic, Imaging & Optoelectronics,
Memory, MEMS / Sensors, LED and Other Applications Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2014 through 2021 and % CAGR
Table 112: Germany 16-Year Perspective for 3D IC and 2.5D IC
Packaging by Application - Percentage Breakdown of Value
Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS /
Sensors, LED and Other Applications for the Years 2014, 2023 &
2030
Table 113: Germany Recent Past, Current & Future Analysis for
3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics,
Telecommunication, Industrial, Automotive, Smart Technologies
and Other End-Uses - Independent Analysis of Annual Revenues in
US$ Million for the Years 2022 through 2030 and % CAGR
Table 114: Germany Historic Review for 3D IC and 2.5D IC
Packaging by End-Use - Consumer Electronics, Telecommunication,
Industrial, Automotive, Smart Technologies and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2014 through 2021 and % CAGR
Table 115: Germany 16-Year Perspective for 3D IC and 2.5D IC
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Telecommunication, Industrial,
Automotive, Smart Technologies and Other End-Uses for the Years
2014, 2023 & 2030
ITALY
Table 116: Italy Recent Past, Current & Future Analysis for 3D
IC and 2.5D IC Packaging by Packaging Technology - 3D
Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent
Analysis of Annual Revenues in US$ Million for the Years 2022
through 2030 and % CAGR
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