Transformative Growth: Global Flip Chip Bonder Market Size to Exceed USD 356.91 Million by 2030 with 3.28% CAGR

New York, NY, Aug. 08, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Flip Chip Bonder Market By Type (Fully Automatic And Semi-Automatic), By Application (IDMs And OSAT), By End-User (Consumer Electronics, Healthcare, Telecommunications, Automotive, And Aerospace & Defense), And By Region - Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2023 – 2030” in its research database.

“According to the latest research study, the demand of global Flip Chip Bonder Market size & share in terms of revenue was valued at USD 278.16 million in 2022 and it is expected to surpass around USD 356.91 million mark by 2030, growing at a compound annual growth rate (CAGR) of approximately 3.28% during the forecast period 2023 to 2030.”

What is Flip Chip Bonder? How big is the Flip Chip Bonder Industry?

Report Overview:

The global flip chip bonder market size was evaluated at $278.16 million in 2022 and is slated to hit $ 356.91 million by the end of 2030 with a CAGR of nearly 3.28% between 2023 and 2030.

Connecting dies, such as those found in semiconductor equipment, integrated chips, micro-electromechanical systems, and integrated passive devices, to one another is the purpose of a flip-chip bonder, which is a mechanism for doing so. After that, these interconnected dies are bumped with solder in order to make connections with the exterior circuitry. Additionally, a flip-chip bonder is also known as a controlled collapse chip connection and goes by the designation C4 in the industry. As a matter of fact, the introduction of new technologies such as smart manufacturing, smart grids, and smart grids will result in an increase in the need for flip-chip bonders. Flip-chip bonding makes it possible to reduce the number of times that wire bonds are required.

The study on the market is an essential resource for understanding the development factors, difficulties, and restraints in the worldwide market sector, as well as the opportunities that exist. The geographical market is covered in depth throughout the flip chip bonder market study, in addition to an in-depth examination of the competition landscape. In addition to that, it contains things like a cash flow analysis, a profit ratio analysis, a market basket analysis, a market attractiveness analysis, a PESTEL analysis, a SWOT analysis, a Porter's five force analysis, and a value chain analysis. In addition, the research on the flip chip bonder industry investigates the investor and stakeholder landscape to assist businesses in making decisions based on empirical evidence.

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Global Flip Chip Bonder Market: Growth Factors

The global market trends will be determined by an increase in the number of goods that incorporate extremely small sensors.

The development of the global market for flip chip bonders will be guided by an increase in the number of applications of the product in the process of miniaturising sensors. In addition to this, the product can be used for the packaging of electrical products like as optical equipment, infrared sensors, SAW equipment, and integrated circuits, among other things. In addition, an increase in the utilisation of flip-chip bonders for high-frequency components will guide the demand of the global market. In addition, the expansion of this market on a global scale will be determined by an increase in the demand for these items within the electronics industry. In addition, the introduction of brand-new products in the coming decade will be a major factor in the explosion of growth that will occur in the international market.

A prominent U.S. company in the manufacturing of flip chip bonders, die-to-wafers, and die-to-de bonders, Smart Equipment Technology (SET), introduced an automatic flip chip bonder known as the NEO HB for direct hybrid bonding procedures in the month of November 2019. IRT Nanoelec's 3D integration project was the impetus behind the development of the new product, which was created in collaboration with CEA-Leti.

The prominent South Korean company Hanmi Semiconductor Company, which is in the business of producing semiconductors, presented a new flip-chip bonder 5.0 in the month of August 2020. The machine was designed with the production of high-end semiconductors in mind. These sorts of moves are very likely to stimulate the expansion of the market in different parts of the world.

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Report Scope

Flip Chip Bonder Market: Segmentation Analysis

There are four main segments that make up the global market for flip chip bonders: type, application, end-user, and geography.

When broken down by operation mode, the global market for flip chip bonders can be divided into two categories: completely automatic and semi-automatic. In addition to this, it is anticipated that the fully automatic sector, which accounted for about half of the global market share in 2022, will have the highest CAGR over the course of the next eight years. The widespread use of completely automatic flip-chip bonders across a wide variety of end-use applications is the primary factor that will drive growth in this market sector over the next few years. In addition, it reduces the amount of time and money required, making it more appealing to a wider range of end-users.  

IDMs and OSATs are the two categories that make up the two different segments of the flip chip bonder market all over the world. These categories are based on the applications. In addition, the IDMs segment, which had already established itself as the dominant player in the application landscape in 2022, is anticipated to lead the expansion of the global market in the years to come. A spike in the demand for flip-chip bonders among IDMs might be responsible for the segmental increase in the timetable for the forecast.

The global market for flip chip bonders can be segmented into the consumer electronics, healthcare, telecommunications, automotive, and aerospace and defence submarkets, depending on the industry that will be using the devices. In addition to this, it is projected that the consumer electronics sector, which made a notable contribution towards the global market share in 2022, will establish global market dominance in the years to come. The widespread adoption of flip chip bonders in consumer electronics devices as a means of connecting a variety of semiconductor and electrical components may be the cause of the segment's growth throughout the forecasted timeframe, which has exceeded expectations.

The global Flip Chip Bonder market is segmented as follows:

By Type

• Fully Automatic
• Semi-Automatic

By Application

• IDMs
• OSAT

By End-User

• Consumer Electronics
• Healthcare
• Telecommunications
• Automotive
• Aerospace & Defense

Browse the full “Flip Chip Bonder Market By Type (Fully Automatic And Semi-Automatic), By Application (IDMs And OSAT), By End-User (Consumer Electronics, Healthcare, Telecommunications, Automotive, And Aerospace & Defense), And By Region - Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2023 – 2030" Report At https://www.zionmarketresearch.com/report/flip-chip-bonder-market

Competitive Landscape

Some of the main competitors dominating the global Flip Chip Bonder market include - 

• Yamaha Motor Co. Ltd.
• SHIBUYA CORPORATION
• TLMI Corp
• Flipchip International LLC
• BE Semiconductor Industries N.V.
• TPT Wire Bonder
• Flip Chip Electronics Pvt. Ltd
• ficon TEC Service GmbH
• Finetech
• Trans Technology Pte Ltd
• BESI
• AMICRA Microtechnologies
• ASMPT
• Muehlbauer
• CeNSE
• Hamni
• Athlete FA
• CoorsTek Semiconductor
• K&S
• Shibaura
• QP Technologies
• Advotech Company Inc.
• SET

 Key Insights from Primary Research:

• According to the analysis shared by our research forecaster, the Flip Chip Bonder market is likely to expand at a CAGR of around 3.28% during the forecast period (2023-2030).                                            
• In terms of revenue, the Flip Chip Bonder market size was valued at around US$ 278.16 million in 2022 and is projected to reach US$ 356.91 million by 2030.
• The global flip chip bonder market is anticipated to record massive growth over the forecast period owing to its use for the packaging of electronic items that include optical equipment, infrared sensors, SAW equipment, and integrated circuits across the globe.
• In terms of type, the fully automatic segment is slated to register the fastest CAGR over the analysis period.
• On the basis of application, the IDMs segment is predicted to dominate the segmental surge over the forecast period.
• Based on end-user, the consumer electronics segment is expected to lead the segment over the forecast timespan.
• Region-wise, the European flip chip bonder market is projected to register the highest CAGR during the assessment timeline.

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Key questions answered in this report:

• What is the market size and growth rate forecast for Flip Chip Bonder industry?
• What are the main driving factors propelling the Flip Chip Bonder Market forward?
• What are the leading companies in the Flip Chip Bonder Industry?
• What segments does the Flip Chip Bonder Market cover?
• How can I receive a free copy of the Flip Chip Bonder Market sample report and company profiles?

Key Offerings:

• Market Size & Forecast by Revenue | 2023−2030
• Market Dynamics – Leading Trends, Growth Drivers, Restraints, and Investment Opportunities
• Market Segmentation – A detailed analysis By Type, By Application, By End-User, and By Region
• Competitive Landscape – Top Key Vendors and Other Prominent Vendors

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Regional Analysis:

Asia-Pacific to account for a major share of the global market over the analysis timeline

Asia-Pacific, which accounted for more than 60% of the global flip chip bonder market share in 2022, is predicted to dominate the global market over the expected timeframe. The market surge in the region over the assessment timeline can be due to a rise in semiconductor production in countries such as Taiwan and South Korea in Asia. For the record, Taiwan Semiconductor Manufacturing Company, a key semiconductor manufacturing firm based in Taiwan, was the largest semiconductor producer in 2022 as it accrued nearly $76 billion while it exported nearly 1.16 trillion of semiconductor units to other countries in 2021. Apart from this, the presence of key players in the region will contribute significantly towards the market revenue in the Asia-Pacific zone.

Furthermore, the flip chip bonder industry in Europe is set to register the fastest CAGR in the assessment timeframe. The key growth driving factors of the industry in the region include a rise in the demand for semiconductors in the various end-user industries such as consumer electronics, automotive, healthcare, telecommunications, and aerospace & defense.

By Region

• North America
  • U.S.
  • Canada
  • Rest of North America
• Europe
  • France
  • UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of Asia Pacific
• The Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of the Middle East & Africa
• Latin America
  • Brazil
  • Argentina
  • Rest of Latin America

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