NEWARK, Del, Aug. 15, 2023 (GLOBE NEWSWIRE) -- The global semiconductor packaging market is anticipated to reach a valuation of US$ 28.6 billion in 2023, driven by collaborations and partnerships. The trend is expected to create new opportunities for the market, leading to a projected CAGR of 6.5% between 2023 and 2033, and reaching a total valuation of approximately US$ 53.7 billion by 2033.
One of the major factors contributing to the growth of the semiconductor packaging market is the shift toward more complex designs. The trend towards complex integrated circuits and multi-chip packages requires sophisticated packaging solutions that can accommodate diverse functionalities, optimize performance, and maintain reliability.
The emphasis on regenerative energy sources and green packaging solutions is pushing the development of semiconductor packages with energy harvesting capabilities and reduced environmental impact.
Drivers and Challenges Impact Market Dynamics. Find more insights in this sample report: https://www.futuremarketinsights.com/reports/sample/rep-gb-15159
The proliferation of Internet of Things (IoT) devices and wearable technology has sparked a demand for compact, energy-efficient, and reliable semiconductor packaging solutions. Packaging technologies that enable miniaturization, low power consumption, and high performance are essential for these connected devices.
The expansion of data centers and cloud computing services necessitates efficient and high-performance semiconductor packaging solutions. Advanced packaging techniques are critical in meeting the demands for faster data processing, storage, and communication within these large-scale computing environments.
Key Takeaways from this Market Study:
- The global semiconductor packaging market was valued at US$ 26.9 billion by 2022 end.
- From 2018 to 2022, the market demand expanded at a CAGR of 3.1%.
- The United States is expected to expand at a dominant CAGR of 6.4 during the forecast period.
- By material, the plastic segment is expected to constitute a CAGR of 6.4% in 2033.
- On the basis of end-use, the consumer electronics segment is expected to dominate the market with a CAGR of 6.4% in 2033.
- From 2023 to 2033, the semiconductor packaging market is expected to flourish at a CAGR of 6.5%.
- By 2033, the market value of semiconductor packaging is expected to reach US$ 53.7 billion.
Resilience in supply chains, across the globe, is a major factor that is expected to propel the growth of the semiconductor packaging market in the near future, remarks an FMI analyst.
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Competitive Landscape:
Prominent players in the semiconductor packaging market are Amkor Technology, ASE Group, Intel Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Fujitsu Limited, Powertech Technology, Inc., Taiwan Semiconductor Manufacturing Company, FlipChip International LLC, HANA Micron Inc., ISI - Interconnect Systems, Veeco Instruments Inc., Signetics, Broadcom Inc., STMicroelectronics NV, Infineon technologies ag, SK Hynix, Robert Bosch, Globalfoundries USA Inc., and Saankhya Labs. Semiconductor Solutions, among others.
Key Companies Profiled:
- Amkor Technology
- ASE Group
- Intel Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments
- Fujitsu Limited
- Powertech Technology, Inc.
- Taiwan Semiconductor Manufacturing Company
- FlipChip International LLC
- HANA Micron Inc.
- ISI - Interconnect Systems
- Veeco Instruments Inc.
- Signetics
- Broadcom Inc.
- STMicroelectronics NV
- Infineon technologies ag
- SK Hynix
- Robert Bosch
- Globalfoundries USA Inc.
- Saankhya Labs. Semiconductor Solutions
Recent Developments are:
- In 2023, TSMC announced the development of a new type of semiconductor packaging called InFO-X. InFO-X is a fan-out wafer-level packaging technology that can accommodate more dies than traditional wafer-level packaging technologies, which can lead to lower costs and better performance.
- In 2022, JCET Group announced the development of a new type of semiconductor packaging called 3D-TSV. 3D-TSV is a through-silicon via technology that can be used to connect multiple dies together in a 3D package, which can lead to significant improvements in performance and power efficiency.
More Valuable Insights Available:
Future Market Insights offers an unbiased analysis of the global semiconductor packaging market, providing historical data for 2018 to 2022 and forecast statistics from 2023 to 2033.
To understand opportunities in the semiconductor packaging market, the market is segmented on the basis of material (plastic, ceramic, and metal), by technology (grid-array, small outline packaging, flat no-leads package, and dual in-line packaging), and by end use industry (consumer electronics, automotive, healthcare, it & telecommunication, and aerospace & defense), across seven major regions (North America, Latin America, Western Europe, Eastern Europe, South Asia & Pacific, East Asia, and Middle East & Africa (MEA)).
The packaging team at Future Market Insights offers expert analysis, time-efficient research, and strategic recommendations with the objective to provide authentic insights and accurate results to help clients worldwide. With a repertoire of over 100+ reports and 1 Billion+ data points, the team has been analyzing the industry lucidly in 50+ countries for over a decade. The team provides a brief analysis of key trends including competitive landscape, profit margin, and research development efforts.
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Key Segments Profiled:
By Material:
- Plastic
- Ceramic
- Metal
By Technology:
- Grid-array
- Small Outline Packaging
- Flat No-leads Package
- Dual In-line Packaging
By End Use:
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Aerospace & Defence
By Region:
- North America
- Latin America
- Western Europe
- Eastern Europe
- South Asia and the Pacific
- East Asia
- Middle East and Africa (MEA)
Explore Trending Reports of Packaging:
Consumer Electronics Packaging Market Demand: The consumer electronics packaging market is projected to reach US$ 35.4 Billion by 2027, at a CAGR of 9.8% from 2022 to 2027.
Flexible Plastic Packaging Market Outlook: The flexible plastic packaging market size is projected to be valued at US$ 36,978 million in 2023 and is expected to rise to US$ 57967.38 million by 2033.
Converted Flexible Packaging Market Analysis: The global converted flexible packaging market is set to enjoy a valuation of US$ 302.5 billion in 2023, and further expand at a CAGR of 4.7% to reach US$ 478.9 billion by the year 2033.
Temperature Controlled Packaging Solutions Market Size: The global temperature-controlled packaging solutions market is all set to witness a staggering CAGR of 8.1% between 2022 and 2030. It is estimated to reach US$ 23.2 Billion by the year 2030.
Protective Packaging Market Growth: The global protective packaging market is likely to extend at a steady CAGR of 5.0% and register a valuation of US$ 46.1 billion in 2033
Next Generation Packaging Market Sales: The global next-generation packaging market would witness a leap of growth at a CAGR of 6.1% between 2022 and 2032, reaching US$ 49.3 Billion between 2022 and 2032.
Thermoform Packaging Market Outlook: The thermoform packaging market size is anticipated to rise at a CAGR of 5.3% during the forecast period. The market is likely to be worth US$ 84.450 Million by 2033.
Confectionery Packaging Market Share: The confectionery packaging market is anticipated to expand its roots at an average CAGR of 4.4% during the forecast period & is anticipated to cross a value of US$ 17.50 billion by 2033.
Packaging Automation Market Trends: The global packaging automation market is projected to register at a moderate-paced CAGR of 8.05% & demand is expected to reach a high of US$ 161.66 Billion By 2033.
Senior Friendly Packaging Market Value: The global senior friendly packaging market is projected to reach US$ 7.6 Billion by 2032, increasing at a CAGR of 5.4% throughout the forecast period.
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