Coherent Logix Selects Kandou’s SerDes IP for its Low-Power, High-Performance C-Programmable Processors
12 mai 2020 11h00 HE
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Kandou Bus
LAUSANNE, Switzerland, May 12, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, confirmed today that Coherent Logix will implement its...
Kandou Named One of Europe’s Most-Promising Growth Companies
15 avr. 2020 11h00 HE
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Kandou Bus
LAUSANNE, Switzerland, April 15, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, was named one of 50 European companies with the most...
Kandou’s Amin Shokrollahi to Address “Future Signaling and Coding: Channel Limitations and Potential Solutions above 112G” at ISSCC
12 févr. 2020 11h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND, Feb. 12, 2020 (GLOBE NEWSWIRE) -- Dr. Amin Shokrollahi, Founder and Chief Executive Officer of Kandou, will present “Future Signaling and Coding: Channel Limitations and...
Kandou to Demonstrate USR SerDes IP, USB4 Retimer at DesignCon 2020
28 janv. 2020 11h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Jan. 28, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy efficient, chip link solutions, will demonstrate its ultra-short reach (USR) SerDes...
Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES
12 déc. 2019 11h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Dec. 12, 2019 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the...
SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
30 oct. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...
Kandou sichert sich 56 Millionen $ in Serie C-Finanzierungsrunde
24 sept. 2019 10h34 HE
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Kandou Bus
LAUSANNE, Schweiz, Sept. 24, 2019 (GLOBE NEWSWIRE) -- Kandou, ein weltweit führendes Unternehmen für IP-Konnektivität und Chiplösungen, hat heute eine zusätzliche Investition in der Höhe von 56...
Kandou Secures $56 Million in Series C Funding
23 sept. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Sept. 23, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in connectivity IP and chip solutions, today announced an additional investment of $56 million, through a consortium...
Kandou Announces Development of USB4™ Retimer
10 sept. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Sept. 10, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C®...
Kandou Announces 100th Patent Grant by U.S. Patent Office
11 déc. 2018 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Dec. 11, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has...