Kandou's David Stauffer to Speak About ENRZ at OFC Market Watch Session
14 mars 2016 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND --(Marketwired - March 14, 2016) - Kandou Bus announced today that David Stauffer of Kandou will speak at the OFC Market Watch session entitled "OIF CEI 56G: Signal...
Kandou's David Stauffer to Speak at the OIF 100G Serial Electrical Links Workshop
07 mars 2016 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - March 07, 2016) - Kandou Bus announced today that David Stauffer of Kandou will speak at the OIF "100G Serial Electrical Links and Beyond" workshop. Dr....
Kandou to Present Chord Signaling(TM) at ISSCC 2016
27 janv. 2016 07h00 HE
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Kandou Bus
SAN FRANCISCO, CA--(Marketwired - January 27, 2016) -
Kandou Bus has announced that it will present two papers and demonstrate its Chord Signaling™ link technology at the 2016 International...
Kandou to Introduce Technique for Increasing the Bandwidth of a Multi-Drop Bus at DesignCon 2016
14 janv. 2016 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - January 14, 2016) -
Kandou Bus will present a paper at DesignCon 2016 that will propose a method for increasing the useful channel spectrum in a...
Kandou to Present Alternative for 56G and Beyond Backplane Interconnect at DesignCon 2016
13 janv. 2016 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - January 13, 2016) -
Kandou Bus will present a paper at DesignCon 2016 that will compare the sensitivity of PAM4 and Ensemble NRZ ("ENRZ") to...
Kandou Delivers One Terabit Per Second of Chip-to-Chip Bandwidth at Less Than One Watt
02 déc. 2015 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - December 02, 2015) - Kandou Bus announced today that their Glasswing physical interface SerDes block, code named GW28-125-USR, has been fully tested and...
Kandou Recognized for "Best European Paper" at ISSCC 2015
02 mars 2015 07h00 HE
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Kandou Bus
SAN FRANCISCO, CA--(Marketwired - Mar 2, 2015) - Kandou Bus received the Jan Van Vessem Award for Outstanding European Paper last week at the International Solid-State Circuits...
Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions
03 nov. 2014 07h00 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - Nov 3, 2014) - Kandou Bus has announced the Glasswing™ family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced...
Kandou Bus to Participate in OIF 56 Gb/s Panel at OFC 2014
11 mars 2014 13h11 HE
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Kandou Bus
LAUSANNE, SWITZERLAND--(Marketwired - Mar 11, 2014) - Brian Holden, V.P. of Product Management at Kandou Bus, will participate in a panel discussion at OFC 2014 entitled "56 Gb/s serial: Why, What,...
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
10 févr. 2014 07h01 HE
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Kandou Bus
SAN FRANCISCO, CA--(Marketwired - Feb 10, 2014) - Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the...