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Micron Notes Appeal of Tokyo District Court's Approval of Elpida Reorganization Plan
29 mars 2013 14h45 HE | Micron Technology, Inc.
BOISE, Idaho, March 29, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) ("Micron") today noted that certain unsecured creditors of Elpida Memory Inc. filed appeals in Tokyo on Friday,...
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Micron Technology, Inc., Reports Results for the Second Quarter of Fiscal 2013
21 mars 2013 16h05 HE | Micron Technology, Inc.
BOISE, Idaho, March 21, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq:MU) today announced results of operations for its second quarter of fiscal 2013, which ended February 28, 2013. For...
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Micron Announces Tokyo District Court Approval of Elpida Reorganization Plan
28 févr. 2013 03h45 HE | Micron Technology, Inc.
BOISE, Idaho, Feb. 28, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) ("Micron") today announced the Tokyo District Court's issuance of an order approving Elpida Memory Inc.'s plan of...
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Micron Introduces SAS Solid-State Drive
26 févr. 2013 08h00 HE | Micron Technology, Inc.
Key Messages: 6 Gb/s SAS interface provides support for dual-port architectures A reliable, high endurance SSD, designed to achieve 10 drive fills per day for five years Micron's XPERT...
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LFoundry Agrees to Acquire Micron Technology Wafer Manufacturing Plant in Italy
25 févr. 2013 17h45 HE | Micron Technology, Inc.
BOISE, Idaho and LANDSHUT, Germany, Feb. 25, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) and LFoundry today announced that the companies have entered into agreements for LFoundry to...
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Micron and Elpida Announce Antitrust Clearance of Transaction by Chinese Ministry of Commerce
19 févr. 2013 16h30 HE | Micron Technology, Inc.
BOISE, Idaho, and TOKYO, Feb. 19, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) ("Micron") and Elpida Memory, Inc. ("Elpida") today announced that the Chinese Ministry of Commerce has...
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Micron Introduces Industry's Smallest 128-Gigabit NAND Flash Device
14 févr. 2013 08h00 HE | Micron Technology, Inc.
Key Messages: New 128Gb TLC NAND device is more than 25% smaller than company's same-capacity MLC NAND device Utilizes Micron's award-winning 20-nanometer (nm) process...
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Micron Embedded Solutions Webcast: Micron Memory for the Interconnected World
14 févr. 2013 08h00 HE | Micron Technology, Inc.
BOISE, Idaho, Feb. 14, 2013 (GLOBE NEWSWIRE) -- What Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor...
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Media Advisory: Micron to Present Flash Storage Outlook at 2013 Pacific Crest Summit
11 févr. 2013 08h00 HE | Micron Technology, Inc.
SAN FRANCISCO, Feb. 11, 2013 (GLOBE NEWSWIRE) -- What Micron Technology, Inc. (Nasdaq:MU), announced today that Ed Doller, vice president of Micron's...
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Micron Technology Samples New Single-Sided DDR3 Dram Module and TE Connectivity Releases Compatible, Single-Sided DDR3 Module Connectors
07 févr. 2013 08h00 HE | Micron Technology, Inc.
BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE)...