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24 juin 2024 11h00 HE | Source: Xpeedic Technology, Inc.

Xpeedic Releases EDA 2024 Platforms to Accelerate Designs, Simulations of Next-Generation High-Frequency, High-Speed Electronic Products

Xpeedic’s EDA 2024 platforms with significant upgrades in solver engines and features is now available
10 juil. 2023 11h00 HE | Source: Xpeedic Technology, Inc.

Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference

EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System SimulationContinuous Demonstrations This Week at Design...
13 juin 2023 14h27 HE | Source: Xpeedic Technology, Inc.

Xpeedic Ships Unprecedented Two-Billionth Integrated Passive Device

Adoption Driven by Need for Smaller, High-Performance, Cost-Effective, Reliable Electronic Systems Xpeedic IPDs, Development Platform Showcased Today Through Thursday at IMS in San Diego SAN DIEGO,...
13 juin 2023 14h25 HE | Source: Xpeedic Technology, Inc.

Xpeedic Releases RF EDA Solution 2023 at IMS

RF EDA Solution Accelerates Design of RF Modules, Systems Using Chip-Package-System EDA tools and IPD IPDemonstrated Today Through Thursday at IMS in San Diego SAN DIEGO, June 13, 2023 (GLOBE...
14 mars 2023 11h00 HE | Source: Xpeedic Technology, Inc.

Xpeedic Takes 2023 3D InCites Herb Reiter Design Tool Provider of the Year Award

CUPERTINO, Calif., March 14, 2023 (GLOBE NEWSWIRE) -- Xpeedic today was named the 2023 Herb Reiter Design Tool Provider of the Year Award recipient by 3D InCites for its Metis platform, developed to...
01 févr. 2023 11h01 HE | Source: Xpeedic Technology, Inc.

Xpeedic Releases Notus at DesignCon2023, Announces Upgrades to Advanced Packaging and High-Speed Digital Solutions

CUPERTINO, Calif., Feb. 01, 2023 (GLOBE NEWSWIRE) -- Xpeedic today released Notus, an electronic design automation (EDA) platform for package/board SI/PI/thermal analysis, at DesignCon 2023 at the...
20 sept. 2022 11h00 HE | Source: Xpeedic Technology, Inc.

Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products

CUPERTINO, Calif., Sept. 20, 2022 (GLOBE NEWSWIRE) -- Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic...