eSilicon Technical Advisory Board Members Win Facebook Research Award
28 mai 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 28, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that two of its...
ESD Alliance CEO Outlook 2019: eSilicon CEO Jack Harding to Participate
15 mai 2019 08h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 15, 2019 (GLOBE NEWSWIRE) -- eSilicon CEO Jack Harding will comment on the state of the application-specific integrated circuit (ASIC) market. What ESD Alliance CEO Outlook...
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
14 mai 2019 18h15 HE
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eSilicon Corporation
SAN JOSE, Calif., May 14, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that a large 2.5D...
eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
09 mai 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 09, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
08 mai 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 08, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will discuss its 14nm...
eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
07 mai 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 07, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
01 mai 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., May 01, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
eSilicon Expands Technical Advisory Board
30 avr. 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., April 30, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the addition of...
eSilicon Signs Multi-Year Agreement with Google Cloud
29 avr. 2019 02h00 HE
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eSilicon Corporation
SAN JOSE, Calif., April 29, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of...
eSilicon awards six scholarships to top female STEM students in Vietnam
03 avr. 2019 08h00 HE
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eSilicon Corporation
SAN JOSE, Calif., and HO CHI MINH CITY, Vietnam, April 03, 2019 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, awarded...