TSMC OIP Award for Open-Silicon HBM Paper
Open-Silicon Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for Best Paper
16 janv. 2018 08h00 HE | Open-Silicon
High Bandwidth Memory (HBM2) IP Subsystem Solution Validation and Interoperability with HBM2 Memory Die Stack MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized...