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eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
18 sept. 2018 05h00 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 18, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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eSilicon to present power optimization paper at SNUG Singapore, September 21, 2018
17 sept. 2018 19h02 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 17, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present Power...
Credo 於台積電 2018 阿姆斯特丹開放創新平臺論壇與技術研討會上展示業界領先的台積電 7奈米製程SerDes
20 juil. 2018 05h00 HE | Credo Semiconductor, Inc.
荷蘭阿姆斯特丹, July 20, 2018 (GLOBE NEWSWIRE) -- Credo(默升科技),串列高速技術的全球領導者,今日宣佈將在下周於阿姆斯特丹舉行的台積電(TSMC) 2018開放創新平臺論壇(OIP Forum)與技術研討會上展示高性能、低功耗的SerDes IP。其中包含基於台積電 12奈米與7奈米製程之單通道速率56G 的PAM4 SerDes。 “身為OIP...
Credo 于台积电 2018 阿姆斯特丹开放创新平台论坛与技术研讨会上展示业界领先的台积电 7奈米工艺SerDes
20 juil. 2018 05h00 HE | Credo Semiconductor, Inc.
荷兰阿姆斯特丹, July 20, 2018 (GLOBE NEWSWIRE) -- Credo(默升科技),串行高速技术的全球领导者,今日宣布将在下周于阿姆斯特丹举行的台积电(TSMC) 2018开放创新平台论坛(OIP Forum)与技术研讨会上展示高性能、低功耗的SerDes IP。其中包含基于台积电 12奈米与7奈米工艺之单通道速率56G 的PAM4 SerDes。 “身为OIP...
Credo Demonstrates Industry Leading SerDes on TSMC’s 7nm Process at TSMC 2018 OIP Forum and Technology Symposium in Amsterdam
20 juil. 2018 05h00 HE | Credo Semiconductor, Inc.
AMSTERDAM, The Netherlands, July 20, 2018 (GLOBE NEWSWIRE) -- Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it will demonstrate its advanced high...