Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.

Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...

nepes Corporation to Acquire Deca Technologies Manufacturing Operations TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...