2018 Sunflower Scholarship
Tổ chức Sunflower Mission trao 59 suất học bổng cho các kỹ sư tương lai của Việt Nam
20 déc. 2018 17h00 HE | eSilicon Corporation; Sunflower Mission
Thành phố Hồ Chí Minh, Việt Nam, Dec. 21, 2018 (GLOBE NEWSWIRE) -- Ngày 20 tháng 12, 2018 –  Tổ chức Sunflower Mission đã đánh dấu 16 năm hỗ trợ giáo dục tại Việt Nam và trao tặng 59 suất...
2018 Sunflower Scholarship
Sunflower Mission awards 59 university scholarships to Vietnam’s future engineers
20 déc. 2018 17h00 HE | eSilicon Corporation; Sunflower Mission
HO CHI MINH CITY, Vietnam, Dec. 20, 2018 (GLOBE NEWSWIRE) -- Sunflower Mission marked its sixteenth year of supporting student education in Vietnam and presented a total of 59 university...
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SemIsrael 2018: eSilicon to present on IP platforms for AI and high-performance networking ASICs
20 nov. 2018 00h00 HE | eSilicon Corporation
SAN JOSE, Calif., Nov. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present its two new...
eSilicon 7nm 56G DSP SerDes
eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
25 oct. 2018 08h00 HE | eSilicon Corporation
Demos and private meetings available at SC18 SAN JOSE, Calif., Oct. 25, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D...
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ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018
24 oct. 2018 08h00 HE | eSilicon Corporation
SAN JOSE, Calif., Oct. 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two...
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Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara
01 oct. 2018 08h00 HE | Open-Silicon
MILPITAS, Calif., Oct. 01, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance...
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eSilicon to demonstrate silicon performance of its 7nm 56G long-reach SerDes at ECOC, September 24-26, 2018
20 sept. 2018 08h00 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate the...
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eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
18 sept. 2018 05h00 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 18, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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eSilicon to present power optimization paper at SNUG Singapore, September 21, 2018
17 sept. 2018 19h02 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 17, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present Power...
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eSilicon Announces Silicon Validation of 7nm 56G SerDes
13 sept. 2018 08h00 HE | eSilicon Corporation
SAN JOSE, Calif., Sept. 13, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, disclosed today that it has...